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GENERAL GUIDELINES 

1.  When servicing, observe the original lead dress. If a 

short circuit is found, replace all parts, which have been 
over-heated or damaged by the short circuit. 

2.  After servicing, see to it that all the protective devices 

such as insulation barriers, insulation papers shields are 
properly installed. 

3.  After servicing, make the following leakage current 

checks to prevent the customer from being exposed to 
shock hazards. 

 

LEAKAGE CURRENT COLD CHECK 

1.  Unplug the AC cord and connect a jumper between the 

two prongs on the plug. 

2. Measure the resistance value, with an ohm meter, 

between the jumpered AC plug and each exposed 
metallic cabinet part on the equipment such as 
screwheads, connectors, control shafts, etc. The 
resistance value must be more than 5M

 
 
 
 
 
 
 
 
 
 

Figure1 

LEAKAGE CURRENT HOT CHECK (See Figure 1) 

1.  Plug the AC cord directly into the AC outlet. 
 

Do not use an isolation transformer for this check. 

2. Connect 

a 1.5K

, 10W resistor, in parallel with a 0.15

 F 

capacitor, between each exposed metallic part on the set 
an a good earth ground such as a water pipe, as shown 
in Figure1. 

3.  Use an AC voltmeter, with 1000 ohms/volt or more 

sensitivity, to measure the potential across the resistor. 

4.  Check each exposed metallic part, and measure the 

voltage at each point. 

5.  Reverse the AC plug in the AC outlet repeat each of the 

above measurements. 

6.  The potential at any point should not exceed 0.15 volts 

RMS. A leakage current tester (Simpson Model 229 
equivalent) may be used to make the hot checks, 
leakage current must not exceed 0.1 milliamp. In case a 
measurement is outside of the limits specified, there is a 
possibility of a shock hazard, and the equipment should 
be repaired and rechecked before it is returned to the 
customer. 

 

ABOUT LEAD FREE SOLDER (PbF) 

Distinction of Pbf PCB: 

PCBs (manufactured) using lead free solder will have a PbF 
stamp on the PCB. 

Caution: 

1.  Pb free solder has a higher melting point than standard 

solder; Typically the melting point is 50–70  (30-40

higher. Please use a high temperature soldering iron. In 
case of the soldering iron with temperature control, 
please set it to 700

20  (370

10

). 

2.  Pb free solder will tend to splash when heated too high 

(about 1100 /600

). 

 

 

 

ELECTROSTATICALLY SENSITIVE (ES) DEVICES 

Some semiconductor (solid state) devices can be damaged 
easily by static electricity. Such components commonly are 
called Electrostatically sensitive (ED) Devices. Examples of 
typical ES devices are integrated circuits and some 
field-effect transistors and semiconductor “chip” components. 
The following techniques should be used to help reduce the 
incidence of component damage caused by static electricity. 
1. Immediately  before  handling any semiconductor 

component or semiconductor-equipped assembly, drain 
off any electrostatic charge on your body by touching a 
known earth ground. 

 

Alternatively, obtain and wear a commercially available 
discharging wrist trap device, which should be removed 
for potential shock reasons prior to applying power to the 
unit under test. 

2.  After removing an electrical assembly equipped with ES 

devices, place the assembly on a conductive surface 
such as aluminum foil, to prevent electrostatic charge 
buildup or exposure of the assembly. 

3.  Use only a grounded tip soldering iron to solder or 

unsolder ES devices. 

4.  Use only an anti-static solder removal device classified 

as “anti-static” can generate electrical charges sufficient 
to damage ES devices. 

5. Do not use freon-propelled chemicals. These can 

generate electrical charges sufficient to damage ES 
devices. 

6. Do not remove a replacement ES device from its 

protective package until immediately before you are 
ready to install it. 

 

(most replacement ES devices are package with leads 
electrically shorted together by conductive foam, 
aluminum foil or comparable conductive material). 

7. Immediately before removing the protective material 

from the leads of a replacement ES device, touch the 
protective material to the chassis or circuit assembly into 
which the device will be installed. 

 

CAUTION: Be sure no power is applied to the chassis or 
circuit, and observe all other safety precautions. 

8. Minimize bodily motions when handling unpackaged 

replacement ES devices. (Otherwise hamless motion 
such as the brushing together of your clothes fabric or 
the lifting of your foot from a carpeted floor can generate 
static electricity sufficient to damage an ES device). 

 

X-RADIATION 

WARNING 

1.  The potential source of X-radiation in EVF sets is the 

High Voltage section and the picture tube. 

2.  When using a picture tube test jig for service, ensure 

that jig is capable of handling 10kV without causing 
X-Radiation. 

Note: 

It is important to use an accurate periodically 
calibrated high voltage meter. 

3.  Measure the High Voltage. The meter (electric type) 

reading should indicate 2.5kV, ±0.15kV. If the meter 
indication is out of tolerance, immediate service and 
correction is required to prevent the possibility of 
premature component failure. To prevent an X-Radiation 
possibility, it is essential to use the specified picture 
tube. 

  SAFETY PRECAUTIONS 

Summary of Contents for AG-HPX250P/EJ/EN

Page 1: ...No AG HPX250P EJ EN Memory Card Camera Recorder ORDER NO BSD1109A47CE D02 Sec 1 Service Information Sec 2 Disassembly Procedures Sec 3 Electrical Adjustment Sec 4 Block Diagrams Sec 5 Schematic Diagrams Sec 6 Printed Circuit Board Sec 7 Exploded Views Replacement Parts List Model No AG HPX260MC ...

Page 2: ...autions to advise non technical individuals of potential dangers in attempting to service a product Products powered by electricity should be serviced or repaired only by experienced professional technicians Any attempt to service or repair the product or products dealt with in this service information by anyone else could result in serious injury or death For AG HPX250P ...

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Page 10: ...evices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternati...

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