Operation manual for Narrow-pitch connectors A35UH
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2017
ACCTF32E 201704
- 9 -
2) FPC board design
(1)
Positions of connectors on the FPC
The FPC board is made by laminating a polyimide layer, copper foil, and adhesive
layers. Since each material has slightly different heat-shrinkable properties,
warpage may occur typically due the reflow heat in the following cases. This may
cause poor soldering. Make sure to arrange the board in a direction that minimizes
warpage.
■
Example of the Assist carrier (ShinEtsu Polymer)
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-prevention purposes.
Since the FPC is soft, it is
difficult to keep it flat.
●
Typical transfer jigs for the board
mounting process
- Magic resin (Daisho Denshi)
- Keiju board (Mitsubishi Resin)
- Assist carrier (ShinEtsu Polymer)
To keep the FPC board flat during
mounting, we recommend the use of a
“Sticky transfer jig” for the wiring board
mounting process.
Workpiece
(FPC board, etc.)
Elastomer
(Weak adhesive layer)
Elastomer
(Strong adhesive layer)
Substrate
Workpiece (FPC, etc.)
Assist carrier
Layout pin
STEP 1:
Provisional fixing of workpiece
STEP 2:
Mounting complete
STEP 3:
Removal of
workpiece
Removal pin
Summary of Contents for A35UH
Page 30: ...ACCTF32E 201704 2017 ...
