12
COMPONENT REMOVAL
Use the following procedure to remove the component. Ensure that the
component and board have been properly prepared (see "Board/Component
Preparation") before removing component. The technique shown is the
Bridgefill Method.
PROCEDURE
1. Ensure that all Board/
Component Preparation has
been performed.
2. Start with a tip temperature of
315°C (600°F) and adjust as
necessary.
3. Enter Tip Offset Constant for the
selected tip.
4. Install QFP Removal Tip into
ThermoPik using Tip Tool.
5. Install vacuum cup onto vacuum
pick tube using Tip Tool.
6. Remove old solder from tip with
sponge. Tin inside and bottom
edges of tip with solder.
7. Lower tip over component
contacting
ALL
leads with tip
(see
&
).
8. Confirm solder melt of
ALL
joints, apply vacuum and lift
component from PCB (see
&
).
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