Osram LE A P1MQ Handling Download Page 9

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2020-06-04  |   Document No.: AN149 

For the connection to the heat sink, please use thermal interface material (for
detailed information on thermal interface material, please refer to Application
Note “AN053_Thermal management of OSRAM OSTAR

®

 Projection light

sources”). The devices can be connected to the heat sink with a screw. 

When mounting the MPCB to the frame or heatsink by means of a screw, metric
cylindrical head screws M1.4 can be used for the mounting and it is generally
recommended that a locking compound are used for each screw. When
mounting the screws (M1.4), it is recommended that you check on the maximum
torque with the screw supplier. Additionally, to avoid MPCB bending which can
have an adverse effect on the thermal interface material and the LED itself, a
maximum torque of 0.2 Nm should be used. There are 4 holes on the MPCB, and
it is recommended to use 2 diagonal holes for mounting and another 2 holes for
aligning them with the register pins.

Assembly of the connector

In order to be able to connect the individual components, the IMS provides pins
for assembling a connector. The recommended connector for each component
can be found in the respective data sheet. Figure 9 shows an assembled
connector.

Figure 9: Assembled connector

It is common in industry to use carriers or pallets for the entire SMT assembly
process (solder paste printing, connector placement, reflow soldering) when
processing PCB-based components. These carriers are typically made of highly
heat-resistant, fiber-reinforced material. The cut-outs, which fit the component
precisely, hold the components in place. This enables a stable and reproducible
assembly with a good soldering process. Figure 10 shows a sketch of a possible
carrier.

Summary of Contents for LE A P1MQ

Page 1: ...ossible in the application In addition to thermal management correct handling and processing of the LEDs are essential for a successful application This application note provides a recommendation for...

Page 2: ...systems that require the highest achievable luminance such as projection applications Since an encapsulation with a material comprising a refractive index 1 may lead to an increase in effective tendu...

Page 3: ...y Files Package CAD Data webpage on the OSRAM Opto Semiconductor website For more information on importing rayfiles and ray measurement files of LEDs from OSRAM Opto Semiconductors please refer to the...

Page 4: ...nsidered as uncritical for processing and assembly by state of the art SMT equipment aligned with ESD precautions To achieve higher ESD protection on the system level additional ESD protection must be...

Page 5: ...r on a tray with a dry pack it should be factory sealed when stored The hermetically sealed package should only be opened immediately before mounting and processing after which the remaining LEDs shou...

Page 6: ...connector size The devices also have a potential free LED backside and the amber and deep blue devices are windowless This avoids losses due to cover reflectivity and stray light Figure 4 shows an ov...

Page 7: ...ors can be contacted for a detailed drawing Figure 6 Example of a tray Handling recommendations In addition to general guidelines on the handling of LEDs additional care should be taken that mechanica...

Page 8: ...ts or anti static plastic gloves is recommended to avoid contamination of the products especially in the keep out area If the products are handled using tweezers a round end type is recommended The ti...

Page 9: ...the LED itself a maximum torque of 0 2 Nm should be used There are 4 holes on the MPCB and it is recommended to use 2 diagonal holes for mounting and another 2 holes for aligning them with the regist...

Page 10: ...ng part must be protected Here it is recommended to use a step down stencil This should have a suitable integrated cavity for the sensitive LED part of the PCB to protect it during the process Figure...

Page 11: ...be performed manually but it is recommended that automated assembly with a pick and place machine is used for mass production For the OSRAM OSTAR Projection Power a standard reflow soldering process...

Page 12: ...e Symbol Pb Free SnAgCu Assembly Unit Min Recommended Max Ramp up rate to preheat 1 25 C to 150 C 2 3 K s Time tS TSmin to TSmax tS 60 100 120 s Ramp up rate to peak 1 TSmax to TP 2 3 K s Liquidus tem...

Page 13: ...light The converted green LED is cast in silicon to ensure maximum system level efficiency OSRAM OSTAR Projection Power SMT devices have a protective tape covering the chip area Figure 15 for the deep...

Page 14: ...this may cause damage to the surface In addition it is recommended to hold the LED metal substrate by using tweezers and applying any force equally to the entire LED package as shown in Figure 17 If t...

Page 15: ...int reliability and heat dissipation for example In most cases it is therefore advantageous to use the recommended solder pad since it is individually adapted to the properties and conditions of the L...

Page 16: ...sfully used the standard SAC 305 Type 3 solder paste HERAEUS F640 SAC 305 Type 3 For process evaluation process control and failure prevention it is recommended to check the solder paste volume with S...

Page 17: ...rated thermal pad to the PCB and high board level reliability it is recommended to control the solder joint quality of the first assembled samples with an X ray image The X ray images in Figure 22 sho...

Page 18: ...nt of rights In no event shall OSRAM Opto Semiconductors GmbH be liable regardless of the legal theory for any direct indirect special incidental exemplary con sequential or punitive damages arising f...

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