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2020-06-04 | Document No.: AN149
Figure 10: Sketch of a possible carrier
In order to obtain an effective soldering process, it is recommended to place the
components with the pins opposite each other.
Before solder paste printing can be performed, the component must be masked
and the light-emitting part must be protected. Here it is recommended to use a
step-down stencil. This should have a suitable integrated cavity for the sensitive
LED part of the PCB to protect it during the process. Figure 11 shows a sketch
of a possible step-down stencil.
Figure 11: Sketch of a step-down stencil with integrated cavity
The use of special slit squeegee blades is required for solder paste printing.
Figure 12 shows a possible arrangement of the carrier and step-down stencil.
Step-down on
squeegee side
Integrated
cavity
