5-12
EP757
SERVICE MANUAL
Introduction Fundamental Principle Mechanical Construction Procedure of Disassembly
Function of Boards
Specifications
Troubleshooting Function Test and Alignment Procedure Firmware Upgrading Procedure DDC Key-In Procedure Appendix
5-3 Thermal Board
5-3.1 The Location of Connector
J1 J2 J3 J10 J4 J5 J8
J7
5-3.2 J1
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