NCP1201
http://onsemi.com
8
TYPICAL CHARACTERISTICS
Figure 15. Default Current Setpoint for Skip Cycle
vs. Junction Temperature
Figure 16. Propagation Delay from Current Detection to
Gate Driver vs. Junction Temperature
Figure 17. Leading Edge Blanking Duration
vs. Junction Temperature
Figure 18. Oscillator Frequency
vs. Junction Temperature
Figure 19. Frequency Jittering
vs. Junction Temperature
T
J
, JUNCTION TEMPERATURE (
°
C)
125
100
75
50
25
0
−25
100
T
DEL
, PROP
AGA
TION DELA
Y (nS)
85
55
40
10
T
J
, JUNCTION TEMPERATURE (
°
C)
125
100
75
50
25
0
−25
400
T
LEB
, LEADING EDGE BLANKING
DURA
TION (nS)
250
100
0
50
300
T
J
, JUNCTION TEMPERATURE (
°
C)
125
100
75
50
25
0
−25
120
F
OS
C
, OSCILLA
T
OR FREQUENCY (kHz)
100
40
0
T
J
, JUNCTION TEMPERATURE (
°
C)
125
100
75
50
25
0
−25
1400
F
jitter
, FREQUENCY JITTER (Hz/V)
800
600
200
0
400
60
T
J
, JUNCTION TEMPERATURE (
°
C)
125
100
75
50
25
0
−25
85
D
max
, MAXIMUM DUTY CYCLE (%)
84
82
80
79
83
20
81
70
25
150
200
350
Figure 20. Maximum Duty Cycle
vs. Junction Temperature
80
100 KHz
60 KHz
1200
1000
100 KHz
60 KHz
T
J
, JUNCTION TEMPERATURE (
°
C)
125
100
75
50
25
0
−25
340
V
ILSKIP
, DEF
AUL
T CURRENT SENSE
THRESHOLD FOR SKIP CYCLE (mV)
320
310
290
300
330
