NCP1060, NCV1060, NCP1063, NCV1063
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30
PACKAGE DIMENSIONS
SOIC−10 NB
CASE 751BQ
ISSUE B
SEATING
PLANE
1
5
6
10
h
X 45
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF ’b’
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DE-
TERMINED AT DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERM-
INED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
D
E
H
A1
A
DIM
D
MIN
MAX
4.80
5.00
MILLIMETERS
E
3.80
4.00
A
1.25
1.75
b
0.31
0.51
e
1.00 BSC
A1
0.10
0.25
A3
0.17
0.25
L
0.40
0.80
M
0
8
H
5.80
6.20
C
M
0.25
M
_
_
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
h
0.37 REF
L2
0.25 BSC
A
TOP VIEW
C
0.20
2X 5 TIPS
A-B D
C
0.10
A-B
2X
C
0.10
A-B
2X
e
C
0.10
b
10X
B
C
C
0.10
10X
SIDE VIEW
END VIEW
DETAIL A
6.50
10X
1.18
10X
0.58
1.00
PITCH
RECOMMENDED
1
L
F
SEATING
PLANE
C
L2
A3
DETAIL A
D
