ON Semiconductor MC14541B, Manual

Page: 9 / 10

MC14541B
www.onsemi.com
8
PACKAGE DIMENSIONS
TSSOP − 14
CASE 948G
ISSUE C
DIM MIN MAX MIN MAX
INCHES MILLIMETERS
A 4.90 5.10 0.193 0.200
B
4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE − W − .
_ _ _ _
S
U 0.15 (0.006) T
2X
L/2
S U M 0.10 (0.004) V S T
L
− U −
SEATING
PLANE
0.10 (0.004)
− T −
ÇÇÇ
ÇÇÇ SECTION N − N
DETAIL E
J J1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
− W −
0.25 (0.010)
8 14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U 0.15 (0.006) T
− V −
14X REF
K
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb − Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.