Octagon XE-900, Reference Manual

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Video
Supports CRTs displays with resolutions up to 1920 x 1440 x 24 bpp, and LVDS
flat panel displays with resolutions up to 1600 x 1200 x 18 bpp.
Watchdog timer
Time-out is 1 second, 10 seconds or 60 seconds. Strobed through built–in, enhanced
INT 17h function calls.
Real time clock
AT compatible with external battery backup.
Expansion
PC/104 and PC/104 -Plus.
Operating systems
Compatible with Windows XPe, Windows CE.net, Linux, QNX, and DOS.
PCI bus mastering
Bus mastering devices are supported on the PC/104 -Plus connector.
Power requirements
5V ±0.25V; 3.3A @ 400 or 733 MHz, 3.4A @ 1 GHz, 10A inrush current
Note The power supply for the XE–900 must meet the startup risetime requirements
specified in the ATX Power Design Guide, version 1.1, section 3.3.5. This ensures
that all the circuitry on the XE–900 SBC sequences properly and avoids system
lockup.
Environmental specifications
Operating temperature –40° to +60°C @ 400 MHz
–40° to +60°C @ 733 MHz, with forced air flow
–40° to +60°C @ 1 GHz, with forced air flow
These operating specification also apply to units
with the Integrated Conductive Cooling System.
Nonoperating temperature –55° to 85°C, nonoperating
Relative humidity 5% to 95% noncondensing
Shock 40g, 3 axis
Vibration 5g, 3 axis
Size
115 mm x 165mm x 29.5 mm, EPIC™ form factor
Weight
8 oz.
Excessive Thermal Stress
This card is guaranteed to operate over the published temperature ranges and
relevant conditions. However, sustained operation near the maximum temperature
specification is not recommended by Octagon or the CPU chip manufacturer due to
well known, thermal related, failure mechanisms. These failure mechanisms,
common to all silicon devices, can reduce the MTBF of the cards. Extended
operation at the lower limits of the temperature ranges has no limitations.