NXP Semiconductors TDA8932B, Product Data Sheet

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NXP Semiconductors
TDA8932B
Class-D audio amplifier
© NXP B.V. 21 June 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 June 2007
Document identifier: TDA8932B_3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
22. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Mode selection and interfacing . . . . . . . . . . . . . 6
8.3 Pulse width modulation frequency . . . . . . . . . . 7
8.4 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.4.1 Thermal Foldback (TF) . . . . . . . . . . . . . . . . . . . 9
8.4.2 OverTemperature Protection (OTP) . . . . . . . . . 9
8.4.3 OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
8.4.4 Window Protection (WP). . . . . . . . . . . . . . . . . . 9
8.4.5 Supply voltage protection . . . . . . . . . . . . . . . . 10
8.5 Diagnostic input and output . . . . . . . . . . . . . . 11
8.6 Differential inputs . . . . . . . . . . . . . . . . . . . . . . 11
8.7 Output voltage buffers. . . . . . . . . . . . . . . . . . . 11
9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
11 Thermal characteristics. . . . . . . . . . . . . . . . . . 16
12 Static characteristics. . . . . . . . . . . . . . . . . . . . 17
13 Dynamic characteristics . . . . . . . . . . . . . . . . . 19
14 Application information. . . . . . . . . . . . . . . . . . 22
14.1 Output power estimation . . . . . . . . . . . . . . . . . 22
14.2 Output current limiting. . . . . . . . . . . . . . . . . . . 24
14.3 Speaker configuration and impedance . . . . . . 24
14.4 Single-ended capacitor . . . . . . . . . . . . . . . . . . 24
14.5 Gain reduction . . . . . . . . . . . . . . . . . . . . . . . . 25
14.6 Device synchronization . . . . . . . . . . . . . . . . . . 26
14.7 Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 26
14.8 Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 27
14.9 SE curves measured in reference design . . . . 29
14.10 BTL curves measured in reference design . . . 33
14.11 Typical application schematics (simplified) . . . 37
15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 40
15.1 Quality information . . . . . . . . . . . . . . . . . . . . . 40
16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 41
17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
17.1 Introduction to soldering . . . . . . . . . . . . . . . . . 43
17.2 Wave and reflow soldering . . . . . . . . . . . . . . . 43
17.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 43
17.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 44
18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 45
19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
20 Legal information . . . . . . . . . . . . . . . . . . . . . . 47
20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 47
20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
20.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 47
20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 47
21 Contact information . . . . . . . . . . . . . . . . . . . . 47
22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48