TDA8932B_3
© NXP B.V. 21 June 2007. All rights reserved.
Product data sheet
Rev. 03— 21 June 2007
42 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
Fig 41. Package outline SOT549-1 (HTSSOP32)
UNIT
A1
A2
A3
bp
c
D
(1)
E
(2)
e
HE
L
Lp
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT549-1
03-04-07
05-11-02
w
M
θ
A
A1
A2
Eh
Dh
D
L
p
detail X
E
Z
exposed die pad side
e
c
L
X
(A3)
0.25
1
16
32
17
y
b
HE
0.95
0.85
0.30
0.19
Dh
5.1
4.9
Eh
3.6
3.4
0.20
0.09
11.1
10.9
6.2
6.0
8.3
7.9
0.65
1
0.2
0.78
0.48
0.1
0.75
0.50
p
v
M
A
A
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-1
A
max.
1.1
0
2.5
5 mm
scale
pin 1 index
MO-153
