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2004 Jan 28

4

 

NXP Semiconductors

Product specification

22 W BTL or 2 

 11 W 

stereo power amplifier

TDA1519C

BLOCK DIAGRAM

mgl491

60

kW

input

reference

voltage

power
ground
(substrate)

+
+

-

5

signal
ground

2

7

9

6

183

W

18.1 kW

3

TDA1519C

TDA1519CSP

15 kW

15 kW

VA

VA

C

m

mute switch

power stage

60

kW

standby
reference
voltage

mute
reference
voltage

1

NINV

RR

INV

OUT2

M/SS

OUT1

GND1

GND2

V

P

4

8

183

W

18.1 kW

VA

C

m

mute switch

power stage

+

-

mute
switch

standby

switch

×1

V

P

Fig.1  Block diagram.

The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs and 4.

Summary of Contents for TDA1519C

Page 1: ...DATA SHEET Product specification Supersedes data of 2001 Aug 24 2004 Jan 28 INTEGRATED CIRCUITS TDA1519C 22 W BTL or 2 11 W stereo power amplifier...

Page 2: ...with TDA1519B TDA1519C and TDA1519CSP GENERAL DESCRIPTION The TDA1519C is an integrated class B dual output amplifier in a 9 lead plastic single in line power package or 20 lead heatsink small outline...

Page 3: ...ut current 4 A Iq tot total quiescent current 40 80 mA Istb standby current 0 1 100 A Isw on switch on current 40 A Inputs Zi input impedance BTL 25 k stereo 50 k Stereo application Po output power TH...

Page 4: ...nd 2 7 9 6 183 W 18 1 kW 3 TDA1519C TDA1519CSP 15 kW 15 kW VA VA Cm mute switch power stage 60 kW standby reference voltage mute reference voltage 1 NINV RR INV OUT2 M SS OUT1 GND1 GND2 VP 4 8 183 W 1...

Page 5: ...itch input INV 9 12 12 inverting input n c 2 4 6 7 9 and 13 to 18 2 4 6 7 9 and 13 to 18 not connected NINV GND1 RR OUT1 GND2 OUT2 VP M SS INV 1 2 3 4 5 6 7 8 9 TDA1519C TDA1519CSP mgr561 Fig 2 Pin co...

Page 6: ...cordance with the Absolute Maximum Rating System IEC 60134 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VP supply voltage operating 17 5 V non operating 30 V load dump protected during 50 ms tr 2 5 ms 45...

Page 7: ...1519CTH and TDA1519CTD in free air 40 K W Rth j c thermal resistance from junction to case TDA1519C TDA1519CTH and TDA1519CTD 3 K W SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply VP supply voltag...

Page 8: ...n 39 40 41 dB SVRR supply voltage ripple rejection on notes 3 and 4 40 dB on notes 3 and 5 45 dB mute notes 3 and 6 45 dB standby notes 3 and 6 80 dB Zi input impedance 50 60 75 k Vn o rms noise outpu...

Page 9: ...f 2 V 4 Frequency f 100 Hz 5 Frequency between 1 and 10 kHz 6 Frequency between 100 Hz and 10 kHz 7 Noise voltage measured in a bandwidth of 20 Hz to 20 kHz 8 Noise output voltage independent of RS Vi...

Page 10: ...B 9 5 4 6 inverting input non inverting input internal 1 2 VP VP power ground 2 signal ground TDA1519C 3 8 7 standby switch mgl493 Fig 6 Stereo application diagram TDA1519C 2200 F 100 nF 220 nF 60 kW...

Page 11: ...o power amplifier TDA1519C 0 20 60 30 40 50 mgr539 4 8 12 16 Iq tot mA VP V Fig 8 Total quiescent current as a function of the supply voltage 0 20 30 0 10 20 mgr540 4 8 12 16 Po W VP V THD 10 0 5 Fig...

Page 12: ...er TDA1519C 12 0 10 1 1 10 102 mgr541 4 8 THD Po W Fig 10 Total harmonic distortion as a function of the output power BTL application RL 4 fi 1 kHz 0 6 0 10 102 103 104 mgu377 0 2 0 4 THD fi Hz Fig 11...

Page 13: ...1 0 75 0 60 0 48 0 38 24 0 23 6 20 0 19 6 10 2 54 12 2 11 8 3 4 3 1 A max 1 2 Eh 6 2 00 1 45 2 1 1 8 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum pe...

Page 14: ...25 0 75 0 60 24 0 23 6 0 48 0 38 10 20 0 19 6 12 2 11 8 2 54 3 4 2 8 2 1 1 9 6 3 0 2 00 1 45 3 4 3 1 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum p...

Page 15: ...stic or metal protrusions of 0 25 mm maximum per side are not included HSOP20 plastic heatsink small outline package 20 leads SOT397 1 D bp Z D1 D2 E1 e 1 10 20 11 pin 1 index detail X Lp Q A A4 A3 A1...

Page 16: ...stic or metal protrusions of 0 25 mm maximum per side are not included SOT418 3 0 5 10 mm scale HSOP20 plastic heatsink small outline package 20 leads low stand off height SOT418 3 A max detail X A2 3...

Page 17: ...ispensing before package placement Several methods exist for reflowing for example convection or convection infrared heating in a conveyor type oven Throughput times preheating soldering and cooling v...

Page 18: ...ion Packing Methods 3 For SDIP packages the longitudinal axis must be parallel to the transport direction of the printed circuit board 4 Hot bar soldering or manual soldering is suitable for PMFP pack...

Page 19: ...TSSOP VSO and VSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm 10 Hot bar or manual soldering is...

Page 20: ...uding negligence warranty breach of contract or any other legal theory Notwithstanding any damages that customer might incur for any reason whatsoever NXP Semiconductors aggregate and cumulative liabi...

Page 21: ...regard to the purchase of NXP Semiconductors products by customer No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for ac...

Page 22: ...on presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher f...

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