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2004 Jan 28

20

 

NXP Semiconductors

Product specification

22 W BTL or 2 

 11 W 

stereo power amplifier

TDA1519C

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published 

and may differ in case of multiple devices. The latest product status information is available on the Internet at 
URL http://www.nxp.com. 

DOCUMENT

STATUS

(1)

PRODUCT 
STATUS

(2)

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product 
development. 

Preliminary data sheet

Qualification

This document contains data from the preliminary specification. 

Product data sheet

Production

This document contains the product specification. 

DEFINITIONS

Product specification

 

 The information and data 

provided in a Product data sheet shall define the 
specification of the product as agreed between NXP 
Semiconductors and its customer, unless NXP 
Semiconductors and customer have explicitly agreed 
otherwise in writing. In no event however, shall an 
agreement be valid in which the NXP Semiconductors 
product is deemed to offer functions and qualities beyond 
those described in the Product data sheet.

DISCLAIMERS

Limited warranty and liability

 

 Information in this 

document is believed to be accurate and reliable. 
However, NXP Semiconductors does not give any 
representations or warranties, expressed or implied, as to 
the accuracy or completeness of such information and 
shall have no liability for the consequences of use of such 
information. 

In no event shall NXP Semiconductors be liable for any 
indirect, incidental, punitive, special or consequential 
damages (including - without limitation - lost profits, lost 
savings, business interruption, costs related to the 
removal or replacement of any products or rework 
charges) whether or not such damages are based on tort 
(including negligence), warranty, breach of contract or any 
other legal theory. 

Notwithstanding any damages that customer might incur 
for any reason whatsoever, NXP Semiconductors’ 
aggregate and cumulative liability towards customer for 
the products described herein shall be limited in 
accordance with the 

Terms and conditions of commercial 

sale

 of NXP Semiconductors.

Right to make changes

 

 NXP Semiconductors 

reserves the right to make changes to information 
published in this document, including without limitation 
specifications and product descriptions, at any time and 
without notice. This document supersedes and replaces all 
information supplied prior to the publication hereof.

Suitability for use

 

 NXP Semiconductors products are 

not designed, authorized or warranted to be suitable for 
use in life support, life-critical or safety-critical systems or 
equipment, nor in applications where failure or malfunction 
of an NXP Semiconductors product can reasonably be 
expected to result in personal injury, death or severe 
property or environmental damage. NXP Semiconductors 
accepts no liability for inclusion and/or use of NXP 
Semiconductors products in such equipment or 
applications and therefore such inclusion and/or use is at 
the customer’s own risk.

Applications

 

 Applications that are described herein for 

any of these products are for illustrative purposes only. 
NXP Semiconductors makes no representation or 
warranty that such applications will be suitable for the 
specified use without further testing or modification. 

Customers are responsible for the design and operation of 
their applications and products using NXP 
Semiconductors products, and NXP Semiconductors 
accepts no liability for any assistance with applications or 
customer product design. It is customer’s sole 
responsibility to determine whether the NXP 
Semiconductors product is suitable and fit for the 
customer’s applications and products planned, as well as 
for the planned application and use of customer’s third 
party customer(s). Customers should provide appropriate 
design and operating safeguards to minimize the risks 
associated with their applications and products. 

Summary of Contents for TDA1519C

Page 1: ...DATA SHEET Product specification Supersedes data of 2001 Aug 24 2004 Jan 28 INTEGRATED CIRCUITS TDA1519C 22 W BTL or 2 11 W stereo power amplifier...

Page 2: ...with TDA1519B TDA1519C and TDA1519CSP GENERAL DESCRIPTION The TDA1519C is an integrated class B dual output amplifier in a 9 lead plastic single in line power package or 20 lead heatsink small outline...

Page 3: ...ut current 4 A Iq tot total quiescent current 40 80 mA Istb standby current 0 1 100 A Isw on switch on current 40 A Inputs Zi input impedance BTL 25 k stereo 50 k Stereo application Po output power TH...

Page 4: ...nd 2 7 9 6 183 W 18 1 kW 3 TDA1519C TDA1519CSP 15 kW 15 kW VA VA Cm mute switch power stage 60 kW standby reference voltage mute reference voltage 1 NINV RR INV OUT2 M SS OUT1 GND1 GND2 VP 4 8 183 W 1...

Page 5: ...itch input INV 9 12 12 inverting input n c 2 4 6 7 9 and 13 to 18 2 4 6 7 9 and 13 to 18 not connected NINV GND1 RR OUT1 GND2 OUT2 VP M SS INV 1 2 3 4 5 6 7 8 9 TDA1519C TDA1519CSP mgr561 Fig 2 Pin co...

Page 6: ...cordance with the Absolute Maximum Rating System IEC 60134 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VP supply voltage operating 17 5 V non operating 30 V load dump protected during 50 ms tr 2 5 ms 45...

Page 7: ...1519CTH and TDA1519CTD in free air 40 K W Rth j c thermal resistance from junction to case TDA1519C TDA1519CTH and TDA1519CTD 3 K W SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply VP supply voltag...

Page 8: ...n 39 40 41 dB SVRR supply voltage ripple rejection on notes 3 and 4 40 dB on notes 3 and 5 45 dB mute notes 3 and 6 45 dB standby notes 3 and 6 80 dB Zi input impedance 50 60 75 k Vn o rms noise outpu...

Page 9: ...f 2 V 4 Frequency f 100 Hz 5 Frequency between 1 and 10 kHz 6 Frequency between 100 Hz and 10 kHz 7 Noise voltage measured in a bandwidth of 20 Hz to 20 kHz 8 Noise output voltage independent of RS Vi...

Page 10: ...B 9 5 4 6 inverting input non inverting input internal 1 2 VP VP power ground 2 signal ground TDA1519C 3 8 7 standby switch mgl493 Fig 6 Stereo application diagram TDA1519C 2200 F 100 nF 220 nF 60 kW...

Page 11: ...o power amplifier TDA1519C 0 20 60 30 40 50 mgr539 4 8 12 16 Iq tot mA VP V Fig 8 Total quiescent current as a function of the supply voltage 0 20 30 0 10 20 mgr540 4 8 12 16 Po W VP V THD 10 0 5 Fig...

Page 12: ...er TDA1519C 12 0 10 1 1 10 102 mgr541 4 8 THD Po W Fig 10 Total harmonic distortion as a function of the output power BTL application RL 4 fi 1 kHz 0 6 0 10 102 103 104 mgu377 0 2 0 4 THD fi Hz Fig 11...

Page 13: ...1 0 75 0 60 0 48 0 38 24 0 23 6 20 0 19 6 10 2 54 12 2 11 8 3 4 3 1 A max 1 2 Eh 6 2 00 1 45 2 1 1 8 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum pe...

Page 14: ...25 0 75 0 60 24 0 23 6 0 48 0 38 10 20 0 19 6 12 2 11 8 2 54 3 4 2 8 2 1 1 9 6 3 0 2 00 1 45 3 4 3 1 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum p...

Page 15: ...stic or metal protrusions of 0 25 mm maximum per side are not included HSOP20 plastic heatsink small outline package 20 leads SOT397 1 D bp Z D1 D2 E1 e 1 10 20 11 pin 1 index detail X Lp Q A A4 A3 A1...

Page 16: ...stic or metal protrusions of 0 25 mm maximum per side are not included SOT418 3 0 5 10 mm scale HSOP20 plastic heatsink small outline package 20 leads low stand off height SOT418 3 A max detail X A2 3...

Page 17: ...ispensing before package placement Several methods exist for reflowing for example convection or convection infrared heating in a conveyor type oven Throughput times preheating soldering and cooling v...

Page 18: ...ion Packing Methods 3 For SDIP packages the longitudinal axis must be parallel to the transport direction of the printed circuit board 4 Hot bar soldering or manual soldering is suitable for PMFP pack...

Page 19: ...TSSOP VSO and VSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm 10 Hot bar or manual soldering is...

Page 20: ...uding negligence warranty breach of contract or any other legal theory Notwithstanding any damages that customer might incur for any reason whatsoever NXP Semiconductors aggregate and cumulative liabi...

Page 21: ...regard to the purchase of NXP Semiconductors products by customer No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for ac...

Page 22: ...on presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher f...

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