NXP Semiconductors LPC8N04 User Manual Download Page 17

UM11082

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2018. All rights reserved.

User Manual

Rev. 1.1 — 12 January 2018 

17 of 18

 

NXP Semiconductors

LPC8N04 Development Board

User Manual

8. Legal 

information

8.1 Disclaimers

Limited warranty and liability — 

Information in this document is believed to be accurate and reliable. However, NXP 

Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of 
such information and shall have no liability for the consequences of use of such information. 

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including 
- without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products 
or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any 
other legal theory. 

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and 
cumulative liability towards customer for the products described herein shall be limited in accordance with the 

Terms and 

conditions of commercial sale

 of NXP Semiconductors.

Right to make changes — 

NXP Semiconductors reserves the right to make changes to information published in this document, 

including without limitation specifications and product descriptions, at any time and without notice. This document supersedes 
and replaces all information supplied prior to the publication hereof.

Suitability for use — 

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life 

support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP 
Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment 
or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — 

Applications that are described herein for any of these products are for illustrative purposes only. NXP 

Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further 
testing or modification. 

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, 
and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s 
sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and 
products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should 
provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any 
weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). 
Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors 
products in order to avoid a default of the applications and the products or of the application or use by customer’s third party 
customer(s). NXP does not accept any liability in this respect.

Export control — 

This document as well as the item(s) described herein may be subject to export control regulations. Export 

might require a prior authorization from national authorities.

8.2 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

Summary of Contents for LPC8N04

Page 1: ...anual Rev 1 1 12 January 2018 1 of 18 NXP Semiconductors LPC8N04 Development Board User Manual UM11082 User Manual for LPC8N04 Development Board Rev 1 1 12 January 2018 User Manual Document informatio...

Page 2: ...NXP B V 2018 All rights reserved User Manual Rev 1 1 12 January 2018 2 of 18 NXP Semiconductors LPC8N04 Development Board User Manual Revision history Rev Date Description 1 0 20171218 First draft 1...

Page 3: ...ker LS1 The LPC8N04 Development Board board includes the following features Compatible with MCUXpresso IDE and other popular toolchains incl IAR and Keil Detachable two section board featuring minimal...

Page 4: ...the layout of the LPC8N04 Development Board board indicating location of jumpers buttons connectors expansion options and MCU devices Fig 2 Board layout top silkscreen SWD LED jumpers P8 P7 SPKR LED j...

Page 5: ...P1 when using this header 4 1 S1 LPC8N04 power on off switch When the switch is open the power is disconnected from the LPC8N04 This switch is provided to prevent accidental draining of the batteries...

Page 6: ...r see installation notes included in the package for further information 3 2 Running the out of box demo The LPC8N04 on the Development Board is pre programmed with a demonstration program which desig...

Page 7: ...enabled on the smartphone then activate the App Tap on the LED TEXT AND MUSIC tab at the top left then the Read NDEF button 3 2 2 Enabling and reading the and scrolling message temperature Bring the p...

Page 8: ...essage in the Text box then tap Write NDEF to write the message to the LPC8N04 The message TAG successfully written should appear along with the speed at which the write took place The LED array will...

Page 9: ...instead of the top row of LEDs see Figure 3 By default the firmware will assume this GPIO is being used for the LED row but will switch to driving the speaker once a push of button S2 is detected Beca...

Page 10: ...Semiconductors LPC8N04 Development Board User Manual 3 2 5 Running demos using energy harvesting If a smart phone with sufficient NFC reader power is used a demo can be run using energy harvesting to...

Page 11: ...DAP protocol This protocol is supported by MCUXpresso IDE and other popular IDEs such as Keil MDK and IAR EWARM It is not normally necessary to update the debug probe firmware but this can be done by...

Page 12: ...click in Import a new project from the file system 4 In the Import project s from file system dialog box that opens click Browse in the Project Archive from zip section and select the LPC8N04 code zi...

Page 13: ...File Explorer or equivalent on Mac Linux platforms look at the available drives on your system A device called CRP_DISABLED will appear 4 Delete the firmware bin file on the CRP_DISABLED drive 5 Drag...

Page 14: ...signals PIO0_11 and PIO0_10 and PIO0_3 which is shared with the speaker driver These three signal may be disconnected for all these functions using P7 P8 and P9 for other I Os to be used the MP and DP...

Page 15: ...that energy harvesting can still operate when the power switch is set in the off position Protection diodes are provided to prevent reverse powering of the coin cell batteries or external debug probe...

Page 16: ...th a scanning technique is provided in the app_demo example code mentioned in Section 3 3 7 3 Speaker and Speaker Driver A surface mount speaker LS1 is provided on the reverse side of the DP section o...

Page 17: ...be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equip...

Page 18: ...7 3 2 3 Updating the scrolling message 8 3 2 4 Playing a tune 9 3 2 5 Running demos using energy harvesting 10 3 3 Setting up the board for Development 11 3 3 1 Using MCUXpresso IDE using on board de...

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