Table 9. 8MMINI-BB Board stack up information
Layer
Description
Coppoer (Oz.)
Dielectric thickness (mil)
1
Signal
0.5+Plating
Dielectric
2.717 mil
2
GND
1
Dielectric
4.33 mil
3
Signal
1
Dielectric
11.085 mil
4
GND
1
Dielectric
14.170 mil
5
Power
1
Dielectric
11.415 mil
6
Power
1
Dielectric
4.33 mil
7
GND
1
Dielectric
2.717 mil
8
Signal
0.5+Plating
Finished:
62.992 (6.299/-6.299) mil
1.6 (+0.16/-0.16) MM
Designed:
59.173 mil
1.503 MM
Material:
TU768
TU768
3.1 EVKB design files
You can download the schematics, layout files, gerber files, and BOM from
.
NXP Semiconductors
PCB information
i.MX 8M Mini LPDDR4 EVKB Board Hardware User's Guide, Rev. 0, February 18, 2021
User's Guide
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