2001 Nov 02
5
NXP Semiconductors
Product specification
860 MHz, 17 dB gain power doubler
amplifier
BGD885
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
DIMENSIONS (mm are the original dimensions)
SOT115D
0
5
10 mm
scale
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads
SOT115D
D
U1
q
q1
b
F
S
A
Z
E
A2
L
c
d
Q
U2
M
w
7
8
9
2
3
W
e
e1
5
6
4
p
y
M
B
x
M
B
1
B
04-02-04
10-06-18
q2
y
M
B
UNIT
A2
max.
c
e
e1
q
Q
max.
q1
q2
U2
U1
W
mm
20.8
9.5
0.51
0.38
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4
38.1 25.4 10.2 4.2
44.75
44.25
8.2
7.8
0.25
0.1
3.8
b
F
p
6-32
UNC
y
w
0.7
x
S
A
max.
D
max.
L
min.
E
max.
Z
max.
d
max.
