Figure 94 Helen3 high level block diagram
OMAP3.3 consists of ARM926 (MPU subsystem), TMS320C55x (DSP subsystem), DMA and OMAP3.3s internal
peripherals.
Helen3s MPU subsystem is based on an ARM926EJ. MPU is able to perform most of the application operations
on the chip.
System DMA: This component is mainly used to help the MPU and DSP perform data memory transfer-specific
tasks, leaving more available MIPS for both processors.
The DSP subsystem is based on a TMS320C55x™ DSP core, which is responsible for intensive data computing
tasks like real-time audio and video handling on application side. E.g. voice recording.
Internal memory subsystem: This subsystem is composed of a single port SRAM.
Secure modules: OMAP1710 contains a set of several components, including ROM, a single port SRAM, and eFUSE
cells. These components enable the system to support secure applications.
Memory interfaces: The memory interfaces define the system memory access organization of OMAP1710.
USB & modem interface: These two modules enable the platform to support a universal serial link and a
dedicated modem interface, enabling a high data transfer rate between the modem and the application chip.
System components: System components are group of modules responsible for managing system interactions
such as interrupt, clock control and idle.
Peripheral subsystem: The peripheral subsystem defines all the components used to interface OMAP1710 with
specific external devices such as camera, keyboard, display etc.
Absolute maximum ratings
Signal
Min
Nom Max
Unit Notes
Battery voltage (idle)
-0.3
+4.5
V
Battery voltage maximum value is
specified during charging is active
Battery voltage (Call)
+4.3
V
Battery voltage maximum value is
specified during charging is active
Charger input voltage
-0.3
+16V
V
RM-57/58
System Module
Nokia Customer Care
Issue 1
Company Confidential
Page 9–9
Copyright ©2005 Nokia. All Rights Reserved.
Summary of Contents for RM-57
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