Nokia 6680 RM-36, Service Manual

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Figure 100 Helen3 high level block diagram
Section Description
Helen3 processor (OMAP1710) also called an application ASIC because it is
processing application SW and handles the UI SW. It
consists of OMAP3.3 and peripheral subsystems like
camera, display and keyboard driver blocks.
OMAP3.3 consists of ARM926 (MPU subsystem), TMS320C55x
(DSP subsystem), DMA and OMAP3.3s internal
peripherals.
Helen3s MPU subsystem based on an ARM926EJ. MPU is able to perform most
of the application operations on the chip.
System DMA component mainly used to help the MPU and DSP perform data
memory transfer-specific tasks, leaving more
available MIPS for both processors.
DSP subsystem based on a TMS320C55x™ DSP core, which is
responsible for intensive data computing tasks like
real-time audio and video handling on application
side, e.g. voice recording.
Internal memory subsystem composed of a single port SRAM.
Secure modules OMAP1710 contains a set of several components,
including ROM, a single port SRAM, and eFUSE cells.
These components enable the system to support
secure applications.
Memory interfaces The memory interfaces define the system memory
access organization of OMAP1710.
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