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N27 Hardware User Guide

Chapter 8 Mounting N27 onto Application PCB

8.2 Application Foot Print

Figure 8-2 Recommended footprint of N27 application PCB (Unit: mm)

8.3 Stencil

The recommended stencil thickness is at least 0.15 mm to 0.20 mm.

8.4 Solder Paste

Do not use the kind of solder paste different from our module technique.



The melting temperature of solder paste with lead is 35°C lower than that of solder paste without

lead. It is easy to cause voiding for LGA inside the module after the second reflow soldering.



When using only solder pastes with lead, please ensure that the reflow temperature is kept at

220°C for more than 45 seconds and the peak temperature reaches 240°C.

Summary of Contents for N27

Page 1: ...Hardware User Guide Issue 2 0 Date 2021 10 15...

Page 2: ...GUIDE PROVIDES INSTRUCTIONS FOR CUSTOMERS TO DESIGN THEIR APPLICATIONS PLEASE FOLLOW THE RULES AND PARAMETERS IN THIS GUIDE TO DESIGN AND COMMISSION NEOWAY WILL NOT TAKE ANY RESPONSIBILITY OF BODILY H...

Page 3: ...l Interfaces 24 4 2 1 PWRKEY_N 24 4 3 Peripheral Interfaces 26 4 3 1 USB 26 4 3 2 UART 27 4 3 3 SIM 29 4 3 4 PCM 31 4 3 5 SPI 35 4 3 6 I2C 36 4 4 RF Interface 37 4 4 1 ANT Interface 37 4 4 2 ANT_GNSS...

Page 4: ...7 Mechanical Features 52 7 1 Dimensions 52 7 2 Label 52 7 3 Packing 53 7 3 1 Packaging 53 7 3 2 Moisture 54 8 Mounting N27 onto Application PCB 55 8 1 Bottom Dimensions 55 8 2 Application Foot Print 5...

Page 5: ...ecommended level shifting network 29 Figure 4 9 Reference design of the SIM card interface 30 Figure 4 10 PCM connection 31 Figure 4 11 PCM sync signal timing 32 Figure 4 12 PCM data input timing 32 F...

Page 6: ...td All rights reserved vi Figure 4 26 Reference design of USB_BOOT 43 Figure 7 1 N27 dimensions Unit mm 52 Figure 8 1 Bottom dimensions of N27 Unit mm 55 Figure 8 2 Recommended footprint of N27 applic...

Page 7: ...le 4 3 Timing parameters of SPI interface 36 Table 5 1 Operating conditions of N27 45 Table 5 2 Current consumption of N27 typical 45 Table 5 3 Temperature feature of N27 46 Table 5 4 ESD protection o...

Page 8: ...ment is intended for system engineers SEs development engineers and test engineers Change History Issue Date Change Changed By 1 0 2019 12 Initial release Longsigh Huang 1 1 2020 04 Modified the varia...

Page 9: ...ce failure or bodily injury may occur Indicates caution This symbol alerts the user to important points about using the module If these points are not followed the module or user device may fail Indic...

Page 10: ...osion or a fire Disable the wireless communication function in places where wireless communication is prohibited Do not use this product that can interfere with other electronic devices in environment...

Page 11: ...Support W1 Cat M1 Cat NB1 Cat NB2 GPRS Cat M1 B1 B2 B3 B4 B5 B8 B12 B13 B18 B19 B20 B25 B26 B27 B28 B31 B66 B72 B73 B85 CATNB1 NB2 B1 B2 B3 B4 B5 B8 B12 B13 B18 B19 B20 B25 B26 B28 B31 B66 B72 B73 B8...

Page 12: ...USB LCD SPI Analog interfaces ADC Figure 2 1 Block diagram Power Manager Baseband Internal memory MDM9205 RF Front end module Interface SIM VBAT RF transceiver SDR105 19 2MHz I2C SDI O SPI UAR T USB...

Page 13: ...Power Class 4 DCS1800 30dBm Power Class 1 LTE CAT M CAT NB 23dBm Power Class 3 Application interfaces 2G 4G antenna GNSS antenna 50 characteristic impedance Two UART interfaces at most 4 Mbit s One SI...

Page 15: ...ND VBAT VBAT GND USIM_DET USIM_VCC USIM_DATA USIM_CLK USIM_RESET GND I2C2_SDA1 I2C2_SCL1 UART2_TXD 73 16 17 18 19 20 21 15 PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK I2S_MCLK ADC21 ADC41 14 UART2_RXD 22 23 24...

Page 16: ...omain VIH min 1 2V VIL max 0 3V VOH min 1 35V VOLmax 0 45V P4 3 3V power supply of USB_PHY core Vtyp 3 3V Table 3 2 Pin description Signal Pin I O Function Level Feature Remarks Power Interface VBAT 2...

Page 17: ...ata transmission Leave this pin floating if it is not used Software open version used as UART1_TXD and used for data transmission and log printing Leave this pin floating if it is not used UART0_RXD U...

Page 18: ...smission Leave this pin floating if it is not used Software open version used as UART2_RXD and used for data transmission and AT commands Leave this pin floating if it is not used UART1_TXD UA RT2_TXD...

Page 19: ...it Leave this pin floating USB_VDD_3P3_ EN 27 B P3 Reserved Leave this pin floating ADC Interface ADC21 20 AI Analog to digital signal conversion Vmax 1 7V Vmin 0 1V Software open version used as ADC4...

Page 20: ...X P3 Software open version Do not use this pin Leave this pin floating PCM_CLK 18 DO PCM clock signal P3 Software open version Do not use this pin Leave this pin floating I2S_MCLK 19 DO I2S main clock...

Page 21: ...rface GNSS_LNA_EN2 69 DO GNSS LNA enable P3 Leave this pin floating if it is not used 1PPS1 68 DO GNSS one pulse per second output Software open version used as 1PPS Pulse signal output WAKEUP_IN 54 D...

Page 22: ...ground plane 4 1 1 VBAT In GSM GPRS mode RF data is transmitted in burst mode that generates voltage drops on the power supply Furthermore this results in a 216Hz TDD noise through the power and the t...

Page 23: ...y Place a bypass capacitor of low ESR close to the module to filter out high frequency jamming from the power supply PCB Layout Place an ESR capacitor at the output of the power supply to absorb surge...

Page 24: ...8V 50mA VDDIO_1P8 is enabled automatically when the module is awake or in a running state It is recommended that VDDIO_1P8 is used for level shift only and a TVS diode should be added 4 2 Control Inte...

Page 25: ...ot perform other operations on the module until it is initialized completely If the module is powered on but the power on process has not been completed the state of each pin is uncertain Figure 4 4 s...

Page 26: ...the signals of pins on the module are named in perspective of the module while peripheral pins are named from the view of the components For example UART_TXD indicates the pin that the module sends da...

Page 27: ...ible Connect common mode inductors to USB_DP and USB_DM in series to prevent the EMI jamming generated by USB PCB layout guidelines Place filer capacitors on the USB_VBUS line as close to the pin of t...

Page 28: ...re open version used as UART2_RXD UART2_RXD 14 DI Data RX Software open version Do not use these pins Leave these pins floating UART2_TXD 13 DO Data TX N27 provides pins to configure three UART interf...

Page 29: ...anging from 1 5V to 5 5V EN is the enable pin which works at a voltage of greater than VL 0 2V In the above circuit the EN pin is connected to VDD_1P8 and the level shifter is always working For more...

Page 30: ...or TVS diodes with a junction capacitance less than 33pF on the USIM signal lines in applications with a high requirement of ESD protection Connect a 20 resistor respectively to USIM_DATA USIM_RESET U...

Page 31: ...M_DIN 16 DI PCM data signal input Software open version Do not use this pin Leave this pin floating PCM_DOUT 17 DO PCM data signal output Software open version Do not use this pin Leave this pin float...

Page 32: ...lkl PCM_CLK PCM_SYNC PCM_DIN MSB LSB t sudin t hdin Figure 4 13 PCM data output timing t clk t clkh t clkl PCM_CLK PCM_SYNC PCM_DOUT MSB LSB t zdout t susync t hsync t pdout t pdout Table 4 1 Timing p...

Page 33: ...CM_DOUT low 60 ns t zdout Delay time from PCM_CLK low to PCM_DOUT high impedance 160 ns N27 provides one I2S interface which is multiplexed from PCM It operates at 1 8 V and can be used for digital au...

Page 34: ...2S_MCLK floating in your application if it is not required for the CODEC chipset selected The I2S function complies with Phillips I2S Bus Specifications revised June 5 1996 Figure 4 15 shows the I2S t...

Page 35: ...Function Remarks SPI4_CLK1 64 DO Clock signal Software open version used as SPI4_CLK Maximum frequency 50 MHz SPI4_MISO1 65 DI Master input Software open version used as SPI4_MISO SPI4_MOSI1 66 DO Mas...

Page 36: ...6 I2C Signal Pin I O Function Remarks I2C2_SCL1 12 DO I2C clock Software open version used as I2C2_SCL Connect this pin to 1 8 V by using an external 2 2 k pull up resistor Leave this pin floating if...

Page 37: ...Do not cross other traces if possible If crossing is inevitable route the I2C traces perpendicular to other traces Keep traces far away from areas that might introduce ESD Surround the traces with the...

Page 38: ...ction capacitance of lower than 0 5 pF Ensure that the reverse breakdown voltage of the TVS is greater than 10V above 15 V is recommended PCB layout guidelines Lay copper foil around the RF connector...

Page 39: ...27 module SAW LNA Schematic guidelines For the impedance matching circuit between N27 and GNSS antenna refer to the last section PCB layout guidelines For guidelines of PCB layout between GNSS interfa...

Page 40: ...fferent application scenarios Antenna interfaces can be connected to a rubber ducky antenna magnet antenna or embedded Planar Inverted F Antenna PIFA Keep external RF wires far away from all disturbin...

Page 41: ...hey cannot cover wide frequencies Figure 4 24 shows the layout of the 2 4G ceramic chip antenna SLDA52 2R540G S1TF is used as an example Figure 4 24 Antenna layout If your PCB is large enough you can...

Page 42: ...are open version used as GPIO_35 GPIO_36 37 B With interrupt Software open version used as GPIO_36 GPIO_37 36 B Software open version used as GPIO_37 GPIO_38 35 B Software open version used as GPIO_38...

Page 43: ...ranges from 0 1 V to 1 7 V The ADC pins support a resolution of 15 bit and it can be used for temperature detection and other checks For details about ADC commands see Neoway_N27_AT_Command_Manual 4 6...

Page 44: ...on Interfaces Copyright Neoway Technology Co Ltd All rights reserved 44 4 6 4 NET_LIGHT NET_LIGHT outputs a continuous pulse signal after the module registers with the network For details about the li...

Page 45: ...7 typical Status Frequency Band Power dBm PSM A Idle mA Active mA TX RX LTE FDD CATM B1 B2 B3 B4 B5 B8 B12 B13 B18 B19 B20 B25 B26 B27 B28 B31 B66 B72 B73 B85 23 4 2 250 x 10 4 2 160 x 0 4 2 124 x 10...

Page 46: ...tion The following table shows the ESD capability of key pins of this module It is recommended to add ESD protection based on the application scenarios to ensure product quality when designing a produ...

Page 47: ...2170MHz FDD LTE B2 1850 1910MHz 1930 1990MHz FDD LTE B3 1710 1785MHz 1805 1880MHz FDD LTE B4 1710 1755MHz 2110 2155MHz FDD LTE B5 824 849MHz 869 894MHz FDD LTE B8 880 915MHz 925 960MHz FDD LTE B12 698...

Page 48: ...TE B3 23dBm 2 2dB 40 dBm HD FDD LTE B4 23dBm 2 2dB 40 dBm HD FDD LTE B5 23dBm 2 2dB 40 dBm HD FDD LTE B8 23dBm 2 2dB 40 dBm HD FDD LTE B12 23dBm 2 2dB 40 dBm HD FDD LTE B13 23dBm 2 2dB 40 dBm HD FDD L...

Page 49: ...e 6 4 RX sensitivity of N27 Cat M1 Band Sensitivity dBm 1 08M Duplex Mode LTE B1 107 HD FDD LTE B2 107 HD FDD LTE B3 107 HD FDD LTE B4 107 HD FDD LTE B5 107 HD FDD LTE B8 107 HD FDD LTE B12 107 HD FDD...

Page 50: ...B1 114 HD FDD LTE B2 114 HD FDD LTE B3 114 HD FDD LTE B4 114 HD FDD LTE B5 114 HD FDD LTE B8 114 HD FDD LTE B12 114 HD FDD LTE B13 114 HD FDD LTE B18 114 HD FDD LTE B19 114 HD FDD LTE B20 114 HD FDD L...

Page 51: ...9 MHz BDSB1 operating frequency 1559 1 1563 1 MHz Galileo E1 GPS L1C BDS B1 BOC 1573 4 1577 5 MHz Tracking sensitivity 159 dBm Acquisition sensitivity 157 dBm Positioning precision in air TBD CEP50 H...

Page 52: ...eatures Copyright Neoway Technology Co Ltd All rights reserved 52 7 Mechanical Features This chapter describes the mechanical features of N27 7 1 Dimensions Figure 7 1 N27 dimensions Unit mm 7 2 Label...

Page 53: ...only for reference The silk screen printing must be clear No blur is allowed The material and surface finishing must comply with RoHS directives 7 3 Packing N27 modules are packed in sealed bags on d...

Page 54: ...ments in compliance with IPC JEDEC J STD 020 standard If the module is exposed to air for more than 48 hours at conditions not worse than 30 C 60 RH bake it at a temperature higher than 90 degrees for...

Page 55: ...reserved 55 8 Mounting N27 onto Application PCB N27 is introduced in a 76 pin LGA package This chapter describes the N27 footprint recommended PCB design and SMT information to guide users on how to...

Page 56: ...least 0 15 mm to 0 20 mm 8 4 Solder Paste Do not use the kind of solder paste different from our module technique The melting temperature of solder paste with lead is 35 C lower than that of solder p...

Page 57: ...avoid poor solder joint caused by PCB bending Figure 8 3 SMT furnace temperature curve Technical parameters Ramp up rate 1 to 4 C sec Ramp down rate 3 to 1 C sec Soaking zone 150 180 C Time 60 100 s R...

Page 58: ...onto Application PCB Copyright Neoway Technology Co Ltd All rights reserved 58 melt Then remove the module using tweezers Do not shake the module in high temperatures while removing it Otherwise the c...

Page 59: ...ment DSP Digital Signal Processor DTE Data Terminal Equipment DTMF Dual Tone Multi Frequency DTR Data Terminal Ready EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility EMI Elec...

Page 60: ...Random Access Memory RF Radio Frequency ROM Read only Memory RMS Root Mean Square RTC Real Time Clock USIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory T...

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