Channel Link Evaluation Kit User Manual
National Semiconductor Corporation
Interface Products
LIT# CLINK3V28BT-85-UM
Rev 2.1
Date: 10/12/2005
Page 15 of 28
BOM (Bill of Materials) Receiver PCB:
HSL Demo Board Schematic REV1
HSL8RXR1 Revision: 1
Channel Link
Item Qty Reference
Part
Pkg
Size
1 1
C1
10
µ
F
CASE D
2 4
C2,C6,C10,C14
0.1
µ
F
1206 (3216)
3 4
C3,C7,C11,C15
22
µ
F
7343 (D)
4 3
C4,C8,C12
0.001
µ
F
0805 (2012)
5 3
C5,C9,C13
0.01
µ
F
0805 (2012)
6 1
JP1
3_PIN_HEADER 0.1"
spacing
7 1
J1
IDC30X2
IDC60
8 1
J2
3M_MDR
26MDR
9
29 R1,R2,R3,R4,R5,R6,R7,R8, Optional
0402 PAD
R9,R10,R11,R12,R13,R14,
(See previous page)
R15,R16,R17,R18,R19,R20,
R21,R22,R23,R24,R25,R26,
R27,R28,R29
6
R35,R36,R37,R38,R39,R40
0
Ohm
0402
10 5
R30,R31,R32,R33,R34 100
Ohm
0402
11 2
TP1,TP2
N/A
TP_.2"X.2"
12 1
U1
DS90CR288AMTD
56-pin
TSSOP