Murata GRM0225C1E8R1CDAEL Reference Sheet Download Page 21

(1) Example of a suitable jig
     [In the case of Single-side Mounting]
       An outline of the board separation jig is shown as follows. 
       Recommended example: Stress on the component mounting position can be minimized by holding the
       portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. 
       Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
       being applied to the component mounting position, if the portion away from the jig is held and bent in the
       direction opposite the side where the capacitors are mounted.

         [Outline of jig]

     [In the case of Double-sided Mounting]
      Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the 
      above method. Therefore, implement the following measures to prevent stress from being applied to the components.

 

   (Measures)

      (1) Consider introducing a router type separator.

 

       

 

If it is difficult to introduce a router type separator, implement the following measures.

            (Refer to item 1. Mounting Position)
      (2) Mount the components parallel to the board separation surface.
      (3) When mounting components near the board separation point, add slits in the separation position 
            near the component.      
      (4) Keep the mounting position of the components away from the board separation point.

(2) Example of a Disk Separator
       An outline of a disk separator is shown as follows.  As shown in the Principle of Operation, the top 
       blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board. 
       In the following case, board deflection stress will be applied and cause cracks in the capacitors.
       (1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, 
             left-right or front-rear directions 
       (2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned   
             top-bottom
       IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the 
       V groove with consideration about strength of material of the printed circuit board.
       

[ Outline of Machine ]

[ Principle of Operation ]

[ Cross-section Diagram ]

Top Blade

Top Blade

Top Blade

Top Blade

Bottom Blade

Bottom Blade

Bottom Blade

Bottom Blade

Not recommended

Recommended

Top-bottom Misalignment

Left-right Misalignment

Front-rear Misalignment

Caution

Recommended

Not recommended

Depth too Shallow

Depth too Deep

Example of

Recommended

V-groove Design

Not Recommended

Left-right Misalignment

Low-Angle

Printed Circuit Board 

Top Blade 

V-groove 

Bottom Blade 

Top Blade 

Printed Circuit Board 

V-groove 

Board Cropping Jig

 

V-groove

 

Printed Circuit Board

 

 

 

 

 

 

 

Printed circuit   
board 

 

Components 

 

Load point 

 

Direction of   
load 

 

 

 

 

 

 

 

Printed circuit   
board 

 

Component

 

Load point 

 

Direction of load

 

JEMCGC-2701W

21

Summary of Contents for GRM0225C1E8R1CDAEL

Page 1: ...Range Ref Temp 8 Packaging 6 Capacitance Tolerance 8 2 pF Temp coeff or Cap Change 0 1 pF This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipm...

Page 2: ...5max W V 6 3V 0 15max 9 Capacitance No bias Within the specified R6 Within 15 The capacitance change should be measured after 5min at each Temperature tolerance Table A 1 55 C to 85 C specified temp s...

Page 3: ...solder solution at 270 5 for 10 0 5 seconds Q D F 30pF and over Q 1000 R6 R7 C8 L8 Set at room temperature for 24 2 hours then measure 30pF and beloow Q 400 20C W V 100V 0 025max C 0 068mF Initial me...

Page 4: ...asurement W V 16V 10V 0 05max W V 6 3V 4V 0 075max C 3 3mF 0 125max C 3 3mF R9 W V 50V 0 075max E4 W V 25V 0 05max F5 W V 25Vmin 0 075max C 0 1mF 0 125max C 0 1mF W V 16V 10V 0 15max W V 6 3V 0 2max I...

Page 5: ...Glass fabric base epoxy resin Thickness 1 6mm GRM02 GRM03 GRM15 t 0 8mm Thickness 1 6mm GRM02 GRM03 GRM15 t 0 8mm Copper foil thickness 0 035mm Copper foil thickness 0 035mm Gray colored part of Fig...

Page 6: ...000 10000 6 4000 10000 9 4000 3000 10000 10000 A B 3000 10000 6 9 4000 10000 M X 3000 10000 C 2000 6000 9 4000 10000 A M 3000 10000 N 2000 8000 C 2000 6000 R D E 1000 4000 M 1000 5000 N R D 1000 4000...

Page 7: ...05 4 0 0 1 1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 t 1 0 0 05 Type LW Dimensions Tolerance Chip A 3 B 3 t GR 03 0 03 0 37 0 67 0 5 max 0 05 0 39 0 69 GR 15 0 05 0 65 1 15 0 8 max 0 1 0 70 1 20 0 15 0 72...

Page 8: ...30 0 15 1 15 max 9 0 2 max 0 85 0 05 0 85 0 1 0 85 0 15 0 1 0 85 0 0 2 0 2 0 85 0 15 0 05 1 50 0 20 2 30 0 20 1 7 max Plastic Tape A 0 1 1 0 0 0 2 1 45 0 20 2 25 0 20 0 2 1 0 0 2 1 50 0 20 2 30 0 20 B...

Page 9: ...GRM F Type 1 5 0 1 0 4 0 0 1 8 0 0 1 1 5 0 2 0 12 0 0 3 5 5 0 1 1 75 0 1 1 2 5 max T 1 8mm 3 7 max T 2 0 2 5mm 4 7 max 2 8 T 3 2mm 1 2 0 0 1 0 3 0 1 Type A 2 B 2 GR 43 3 60 4 90 GR 55 5 20 6 10 2 Nomi...

Page 10: ...ified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GR 01 02 8 0 max 5 1 5 GR 32 max 16 5 max 10 1 5 GR 43 55 20 5 max 14 1 5 180 0 3 0 330 2 0 50 m...

Page 11: ...om tape 1 9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dim...

Page 12: ...with the termination external electrodes or lead wires of capacitors and result in poor solderability Do not store the capacitors in an atmosphere consisting of corrosive gas e g hydrogen sulfide sul...

Page 13: ...rical short circuit caused by the breakdown of the internal dielectric layers The time duration until breakdown depends on the applied voltage and the ambient temperature 4 Type of Applied Voltage and...

Page 14: ...h the capacitance value decreases with the passage of time When you use a high dielectric constant type capacitors in a circuit that needs a tight narrow capacitance tolerance e g a time constant circ...

Page 15: ...on surface A C Mounting Capacitors Near Screw Holes When a capacitor is mounted near a screw hole it may be affected by the board deflection that occurs during the tightening of the screw Mount the ca...

Page 16: ...so as not to bend the printed circuit board 2 Adjust the nozzle pressure within a static load of 1N to 3N during mounting Incorrect Correct 2 Dirt particles and dust accumulated between the suction n...

Page 17: ...table 1 Table 1 GRM01 02 03 15 18 21 31 GRM32 43 55 In the case of repeated soldering the accumulated Recommended Conditions soldering time must be within the range shown above Lead Free Solder Sn 3 0...

Page 18: ...and end termination 4 When components are immersed in solvent after mounting be sure to maintain the temperature differential T between the component and solvent within the range shown in the table 2...

Page 19: ...omponent 2 1 If the distance from the hot air outlet of the spot heater to the component is too close cracks may occur due to thermal shock To prevent this problem follow the conditions shown in Table...

Page 20: ...stress as shown at right may cause the capacitor to crack Cracked capacitors may cause deterioration of the insulation resistance and result in a short Avoid this type of stress to a capacitor Bending...

Page 21: ...paration point 2 Example of a Disk Separator An outline of a disk separator is shown as follows As shown in the Principle of Operation the top blade and bottom blade are aligned with the V grooves on...

Page 22: ...rd Periodically check and adjust the bottom dead point 2 2 Inserting Components with Leads into Boards When inserting components transformers IC etc into boards bending the board may cause cracks in t...

Page 23: ...is not turned off or unplugged the hazards may be worsened by supplying continuous power 2 In this type of situation do not allow face and hands to come in contact with the capacitor or burns may be...

Page 24: ...t of capacitors 1 1 Capacitors when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2...

Page 25: ...a chip is different depending on PCB material and structure When the thermal expansion coefficient greatly differs between the board used for mounting and the chip it will cause cracking of the chip d...

Page 26: ...within 0 20 3 2 1 6 0 30 in mm GRM01 0 25 0 125 0 10 to 0 11 0 07 to 0 12 0 125 to 0 145 0 4 to 0 6 0 40 to 0 50 GRM31 3 2 1 6 2 2 to 2 6 1 0 to 1 1 GRM02 0 4 0 2 0 16 to 0 2 0 12 to 0 18 Notice L W a...

Page 27: ...throughout A foaming system is generally used for flow solderring 2 Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless there is sufficient cleaning Use...

Page 28: ...performance of a capacitor may be affected by the conditions during transportation 1 1 The capacitors shall be protected against excessive temperature humidity and mechanical force during transportati...

Page 29: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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