4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
[Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range [Allowable Reflow Soldering Temperature and Time]
shown in the table 1.
Table 1
GRM01/02/03/15/18/21/31
GRM32/43/55
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
*GRM01 : 1/2 of Chip Thickness min.
strength on the outer electrode, which may result in
GRM02/03: 1/3 of Chip Thickness min.
chips breaking loose from the PCB.
in section
4-3. Make sure the solder has been applied smoothly
to the end surface to a height of 0.2mm* min.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Part Number
Temperature Differential
Caution
ΔT
≦
190
℃
ΔT
≦
130
℃
Lead Free Solder
Peak Temperature
Air or N
2
Atmosphere
Inverting the PCB
240 to 260
℃
!
Temperature(
℃
)
Peak Temperature
Soldering
Gradual
Cooling
Preheating
Δ
T
60-120 seconds 30-60 seconds
Time
190
℃
170
℃
150
℃
220
℃
S
o
ld
er
in
g
Te
m
p
er
at
ur
e
(
℃
)
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
0.2mm min*
JEMCGC-2701W
17
