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No

Item

Test  Method

1 Operating

5C : -55

 to 125

Reference Temperature : 25

Temperature Range

2 Rated Voltage

See the previous pages.

The rated voltage is defined as the maximum voltage which may
be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, V

P-P

 or  V

O-P

,

whichever is larger, should be maintained within the rated voltage
range.

3 Appearance

No defects or abnormalities.

Visual inspection.

4 Dimension

Within the specified dimensions.

Using calipers. 

5 Dielectric Strength

No defects or abnormalities.

No failure should be observed when 250% of the rated voltage
is applied between the terminations for 1 to 5 seconds, 
provided the charge/discharge current is less than 50mA.

6 Insulation 

More than 10,000MΩ

The insulation resistance should be measured with a DC voltage 

      Resistance

not exceeding the rated voltage at 25

 and 75%RH max.

and within 2 minutes of charging, provided the charge/discharge 
current is less than 50mA.

7 Capacitance

Within the specified tolerance. 

The capacitance/Q should be measured at 25

 at the frequency

and voltage shown in the table.

8 Q

30pFmin. : Q

1400

30pFmax.: Q

800+20C

C:NominalCapacitance (pF) 

9

Capacitance

Temperature Within the specified tolerance.(Table A-1)

The capacitance change sholud be measured after 5 min. at

Temperature

Coefficent

each specified temp. stage.

Characteristics

The temperature coefficient is determind using the capacitance 
measured in step 3 as a reference.
When cycling the temperature sequentially from step 1 through 5 

 

the capacitance should be within the specified tolerance for the 

Capacitance Within ±0.2% or ±0.05pF

temperature coefficient and capacitance change as Table A-1.

Drift

(Whichever is larger.)

The capacitance drift is caluculated by dividing the differences 
betweeen the maximum and minimum measured values in the 
step 1,3 and 5 by the cap. value in step 3.

10 Adhesive Strength of 

No removal of the terminations or other defect 

Solder the capacitor on the test jig (glass epoxy board) shown 

Termination

should occur. 

in Fig.3 using an eutectic solder. 
Then apply 10N force in parallel with the test jig for 10±1seconds.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.

11 Vibration 

Appearance No defects or abnormalities.

Solder the capacitor on the test jig (glass epoxy board) in the

Resistance

same manner and under the same conditions as (10). 

Capacitance Within the specified tolerance.

The capacitor should be subjected to a simple harmonic motion 
having a total amplitude of 1.5mm, the frequency being varied 

Q

30pFmin. : Q

1400

uniformly between the approximate limits of 10 and 55Hz.

30pFmax.: Q

800+20C

The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute.

C:NominalCapacitance (pF)

This motion should be applied for a period of 2 hours in each 3
mutually perpendicular directions(total of 6 hours).

 

 

12 Deflection

Appearance No defects or abnormalities.

Solder the capacitor on the test jig (glass epoxy board) shown
in Fig.1 using an eutectic solder.

Capacitance Within ±5

 or ±0.5pF

Then apply a force in the direction shown in Fig 2 for 5±1seconds.

Change

(Whichever is larger)

The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and
free of defects such as heat shock.

13 Solderability

75% of the terminations is to be soldered  

Immerse the capacitor in a solution of ethanol (JIS-K-8101)

of Termination

evenly and continuously.

and rosin (JIS-K-5902) (25% rosin in weight propotion).
Preheat at 80 to 120

  for 10 to 30 seconds.

After preheating, immerse in an eutectic solder solution for 
2±0.5 seconds at 230±5

 or Sn-3.0Ag-0.5Cu solder solution

for 2±0.5 seconds at 245±5

SPECIFICATIONS AND TEST METHODS

Specification

 

 

 

         

Char. 

Item 

5C 

(1000pF and below) 

Frequency 

1

0.1MHz 

Voltage 

0.5 to 5Vrms 

 

  

Step 

Temperature(

C) 

25

-55

25

125

25

JEMCNS-0026

2

Summary of Contents for GQM22M5C2H680FB01 Series

Page 1: ...30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capacitance Toler...

Page 2: ...f the terminations or other defect Solder the capacitor on the test jig glass epoxy board shown Termination should occur in Fig 3 using an eutectic solder Then apply 10N force in parallel with the tes...

Page 3: ...sure Capacitance Within 5 or 0 5pF Change Whichever is larger Q 30pF and over Q 350 10pF and over 30pF and below Q 275 5C 2 C Nominal Capacitance pF I R More than 1 000M 17 Humidity Load The measured...

Page 4: ...1 6mm Copper foil thickness 0 035mm Copper foil thickness 0 035mm Gray colored part of Fig 1 Solder resist Coat with heat resistant resin for solde Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS A...

Page 5: ...e K GQM18 4000 10000 GQM2 4000 10000 GQM2 1000 4000 1 2 Dimensions of Tape 1 GQM18 21 in mm Code GQM18 GQM21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 2 GQM22 Code GQM22 A 2 8 B 3 5 Nominal Value PACKA...

Page 6: ...Hole As specified in 1 2 Hole for Chip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence 180 0 3 0 330 2 0 50 min 13 0 5 2 0 0 5 Chip in mm Fig...

Page 7: ...om tape 1 9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dim...

Page 8: ...ight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wi...

Page 9: ...ntended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measureme...

Page 10: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 11: ...perature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors cha...

Page 12: ...inted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting positio...

Page 13: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 14: ...Time Recommended Conditions Pb Sn Solder Lead Free Solder Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3...

Page 15: ...nd Time be sure to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to GQM22 Series Table 2 GQM18 21 31 T 150...

Page 16: ...Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GQM18 the top of the solder fillet should be lower...

Page 17: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 18: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Page 19: ...thers 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsene...

Page 20: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 21: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 22: ...m the suitable land dimension by evaluating of the actual SET PCB Table 1 Flow Soldering Method Dimensions Part Number in mm Table 2 Reflow Soldering Method Dimensions Part Number in mm Notice Chip L...

Page 23: ...absorption Control curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a dete...

Page 24: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 25: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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