Adhesive Strength of Termination, Vibration Resistance,Temperature Cycle,
Test method : Deflection
Humidity ,Humidity Load,High Temperature Load
・
Test substrate
・
Test substrate
Material : Copper-clad laminated sheets for PCBs
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
(Glass fabric base, epoxy resin)
Thickness : 1.6m
Thickness : 1.6mm
Copper foil thickness : 0.035mm
Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
(Coat with heat resistant resin for solde)
Fig.1
(in:mm)
Fig.3
(in mm)
Fig.2
(in mm)
■
SPECIFICATIONS AND TEST METHODS
＊2
4.0±0.1
8.
0±
0.
3
3.5
±
0
.0
5
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
100
40
a
c
b
Land
f
4.5
c
＊2
4.0±0.1
8
.0
±
0.
3
3.5
±
0
.0
5
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
a
c
b
ﾗﾝﾄﾞ
f
4.5
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
45
45
R230
20
50
Flexure:
≦
1
Capacitance meter
Pressurizing
speed
1.0mm/sec.
Support
Capacitor
Pressurize
45
45
Type
a
b
c
GQM22
2.2
5.0
2.9
Type
a
b
c
GQM22
2.2
5.0
2.9
JEMCNS-0026
4
