Murata GCM21BC71E475KE36 Series, Reference Sheet, Page: 5 / 28

18 Board Flex Appearance No marking defects Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5
±
1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
Capacitance C7: Within ±10.0% soldering is uniform and free of defects such as heat shock.
Change
Dissipation C7: 0.1max
Factor
Insulation 50
Ω ・F
min.
Resistance (in mm)
19 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in
Strength Fig.3 using a eutectic solder. Then apply *18N force in parallel with
Capacitance Within specified tolerance the test jig for 60sec.
Change The soldering should be done either with an iron or using the reflow
Dissipation C7: 0.1max method and should be conducted with care so that the soldering is
Factor uniform and gree of defects such as heat shock
*2N(GCM15)
Insulation 50
Ω
・
F min.
Resistance
(in mm)
20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm max. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : 0.5mm / sec.
Chip thickness
≧
1.25mm rank : 54.5N
Chip thickness > 0.5mm rank : 20N
Chip thickness
≦
0.5mm rank : 8N
■
AEC-Q200 Murata Standard Specification and Test Methods
No AEC-Q200 Test Item AEC-Q200 Test Method Specification.
Chip thickness < 1.25mm rank : 15N
t : 1.6mm
Fig.4
(GCM15:0.8mm)
Type a b c
GCM15 0.5 1.5 0.6
GCM18 0.6 2.2 0.9
GCM21 0.8 3.0 1.3
GCM31 2.0 4.4 1.7
GCM32 2.0 4.4 2.6
＊2
4.0±0.1
8.
0±
0.
3
3.5
±
0.
05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
100
40
a
c
b
C
Fig.1
Type a b c
GCM15 0.4 1.5 0.5
GCM18 1.0 3.0 1.2
GCM21 1.2 4.0 1.65
GCM31 2.2 5.0 2.0
GCM32 2.2 5.0 2.9
＊2
4.0±0.1
8
.0
±
0.
3
3.5
±
0
.0
5
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f
4.5
c
Solder resist
Baked electrode or
Copper foil
b
T:1.6mm
(GCM15:0.8mm)
Fig.3
Iron Board
L
0.6L
45 45
Flexure：≦2
(High Dielectric Type)
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45 45
Fig.2
R4
20
114
JEMCGS-02374 5