2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has
an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Dimensions
Part Number
GC
□
31
3.2×1.6
2.2
～
2.6
1.0
～
1.1
1.0
～
1.4
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Part Number
GC
□
31
3.2×1.6
2.2
～
2.4
0.8
～
0.9
1.0
～
1.4
GC
□
32
3.2×2.5
2.0
～
2.4
1.0
～
1.2
1.8
～
2.3
(in mm)
GC
□
15
GC
□
18
GC
□
21
0.6
～
0.8
2.0×1.25
1.0
～
1.2
0.9
～
1.0
0.8
～
1.1
GC
□
18
Chip
（
L×W
）
GC
□
03
c
0.6×0.3
0.2
～
0.3
0.2
～
0.35
0.2
～
0.4
GC
□
21
1.6×0.8
0.6
～
1.0
Notice
a
b
Chip
（
L×W
）
0.6
～
0.7
0.6
～
0.8
a
b
c
0.8
～
0.9
2.0×1.25
1.0
～
1.2
0.6
～
0.7
0.8
～
1.1
1.0×0.5
0.3
～
0.5
0.35
～
0.45
0.4
～
0.6
1.6×0.8
0.6
～
0.8
Chip Capacitor Land
Solder Resist
a
b
C
JEMCGC-2702N
25
