Application,
Material/
Soiling
circuit
boards
flux with
resin
circuit
boards
water soluble
flux
solder
frames
flux with
resin
solder
frames
water soluble
flux
Program
P 004
LEI-KOL
P 005
LEI-WASSER
P 003
LOETRAHMEN
P 003
LOETRAHMEN
Wash
temperature
T1 (°C)
65 - 75
65 - 75
75
3 - 10 minutes
65 - 75
Wash
temperature
T2 (°C)
65
65 - 75
65 - 75
65 - 75
Cleaning agent
1)
Concentration
2)
for use
neutral,
with tensides
0.5 - 0.7 %
alkaline,
with silica
0.5 %
anti-foam
additive
required
alkaline,
with silica
0.5 %
anti-foam
additive not
always required
Neutralizer
1)
Concentration
2)
for use
slightly acidic,
citric or
phosphoric
acid base
0.1 - 0.15 %
slightly acidic,
citric or
phosphoric
acid base
0.1 - 0.15 %
Notes
a second
cleaning
agent may be
necessary
where foam
occurs use
silicone-free
anti-foaming
agent
do not use neutralizers if susceptible steel
items are cleaned on the frames
(Delete Step 11), and set T2 to 65 °C.
1) Characteristics of cleaning and neutralizing agents are given, not product names.
2) Concentration for use = percentage of the chemical additive in the wash water solution
Water requirement / wash cycle = approximately 15 liters, e.g.:
0.1 % = 0.5 fl.oz. (15 ml) or 15 g amount to be dispensed
0.3 % = 1.6 fl.oz. (45 ml) or 45 g amount to be dispensed
0.5 % = 2.6 fl.oz. (75 ml) or 75 g amount to be dispensed
0.7 % = 3.7 fl.oz. (105 ml) or 105 g amount to be dispensed
Applications Electronics
21
Summary of Contents for IR 6001
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