6
SPECIFICATIONS
6.1
FLUIDIC CONNECT 4515
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6.2
FLUIDIC CONNECTIONS
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6.3
FLUIDIC SLIDE (CARTRIDGE AROUND CHIP)
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Chip Holder
Maximum pressure
: 100 bar / 1450 psi (10 bar for thin bottom chips)
Maximum working temperature
: 50 °C (with Fused Silica Connection Kit)
80 °C (with Teflon or Stainless Steel Connection Kit)
Dimensions (l x w x h)
: 80 x 55 x 9.5 mm
Material holder
: stainless steel 316
Inverter Frame
Maximum working temperature
: 80 °C
Dimensions of frame ( l x w x h)
: 100 x 75 x 24 mm
Material of frame
: POM (Polyoxymethylene)
Fused Silica Connection Kit
Dimensions capillaries
: 360-375
µ
m OD, 150
µ
m ID
Material nuts
: PEEK (Polyether ether ketone)
Material fittings
: Perlast ™
Teflon Connection Kit
Dimensions capillaries
: 1/16” OD, 250
µ
m ID
Material nuts
: PEEK (Polyether ether ketone)
Material fittings
: PEEK (seals) / stainless steel (rings)
Stainless Steel Connection Kit
Dimensions capillaries
: 1/16” OD, 250
µ
m ID
Material nuts
: PEEK (Polyether ether ketone)
Material fittings
: PEEK (seals) / stainless steel (rings)
Maximum working temperature
: 80 °C
Material Fluidic Slide
: PP (Polypropylene)
Fluidic Connect 4515 - User Manual V1.5
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