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TC4451/TC4452

DS20001987C-page 10

 2006-2014 Microchip Technology Inc.

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in 

Table 3-1

.

3.1

Supply Input (V

DD

)

The V

DD

 input is the bias supply for the MOSFET driver

and is rated for 4.5V to 18V with respect to the ground
pin. The V

DD

 input should be bypassed to ground with

a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A minimum value of 1.0 µF is suggested.

3.2

Control Input (INPUT)

The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input also has
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.

3.3

CMOS Push-Pull Output (OUTPUT, 
OUTPUT)

The MOSFET driver output is a low-impedance,
CMOS, push-pull style output capable of driving a
capacitive load with 12A peak currents. The MOSFET
driver output is capable of withstanding 1.5A peak
reverse currents of either polarity.

3.4

Ground (GND)

The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.

3.5

Exposed Thermal Pad (EP)

The exposed thermal pad of the 6x5 DFN-S package is
not internally connected to any potential. Therefore,
this pad can be connected to a ground plane or other
copper plane on a printed circuit board (PCB) to help
remove heat from the package.

3.6

Thermal Tab

The thermal tab of the TO-220 package is connected to
the V

DD

 potential of the device and this connection is

used as a current-carrying path.

TABLE 3-1:

PIN FUNCTION TABLE

8-Pin PDIP, 

SOIC

8-Pin DFN-S

5-Pin TO-220

Symbol

Description

1

1

V

DD

Supply input, 4.5V to 18V

2

2

1

INPUT

Control input, TTL/CMOS-compatible input

3

3

NC

No connection

4

4

2

GND

Ground

5

5

4

GND

Ground

6

6

5

OUTPUT/OUTPUT

CMOS push-pull output

7

7

OUTPUT/OUTPUT

CMOS push-pull output

8

8

3

V

DD

Supply input, 4.5V to 18V

9

EP

Exposed thermal pad

TAB

V

DD

Thermal tab is at the V

DD

 potential

Summary of Contents for TC4451

Page 1: ...ansistors IGBTs The TC4451 TC4452 have matched output rise and fall times as well as matched leading and falling edge propagation delay times The TC4451 TC4452 devices also have very low cross conduct...

Page 2: ...4451 Tab is Common to VDD Note 1 Duplicate pins must both be connected for proper operation 2 Exposed thermal pad EP of the DFN S package is electrically isolated see Table 3 1 TC4451 8 Pin DFN S 1 2...

Page 3: ...ology Inc DS20001987C page 3 TC4451 TC4452 Functional Block Diagram Effective Input Output Input GND VDD 300 mV 4 7V C 25 pF Inverting Non Inverting 140 A Cross Conduction Reduction and Pre Drive Circ...

Page 4: ...0 Low Input Voltage VIL 1 3 0 8 V Input Current IIN 10 10 A 0V VIN VDD Input Voltage VIN 5 VDD 0 3 V Output High Output Voltage VOH VDD 0 025 V DC Test Low Output Voltage VOL 0 025 V DC Test Output R...

Page 5: ...1 CL 15 000 pF Propagation Delay Time tD1 55 65 ns Figure 4 1 CL 15 000 pF Propagation Delay Time tD2 55 65 ns Figure 4 1 CL 15 000 pF Power Supply Power Supply Current IS 200 400 A VIN 3V 50 150 A V...

Page 6: ...not tested or guaranteed In some graphs or tables the data presented may be outside the specified operating range e g outside specified power supply range and therefore outside the warranted range 0 2...

Page 7: ...on Delay ns Supply Voltage V tD2 tD1 CLOAD 15 000 pF VIN 5V 40 45 50 55 60 65 70 75 80 85 90 95 100 2 3 4 5 6 7 8 9 10 Propagation Delay ns Input Amplitude V tD2 tD1 CLOAD 15 000 pF VDD 10V 30 35 40 4...

Page 8: ...put Threshold V Supply Voltage V VIH VIL 0 0 0 5 1 0 1 5 2 0 2 5 3 0 3 5 4 0 4 6 8 10 12 14 16 18 Supply Voltage V R OUT HI TJ 125o C TJ 25o C VIN 5V TC4452 VIN 0V TC4451 0 0 0 5 1 0 1 5 2 0 2 5 3 0 4...

Page 9: ...nt vs Frequency VDD 6V 0 50 100 150 200 250 10 100 1000 10000 Supply Current mA Frequency kHz VDD 18 V 0 1 F 47 000 pF 22 000 pF 15 000 pF 10 000 pF 1 000 pF 470 pF 0 50 100 150 200 250 10 100 1000 10...

Page 10: ...apable of withstanding 1 5A peak reverse currents of either polarity 3 4 Ground GND The ground pins are the return path for the bias current and for the high peak currents that discharge the load capa...

Page 11: ...Non Inverting Driver Input tD1 tF tR tD2 Input 100 kHz square wave tRISE tFALL 10 ns Output Input Output tD1 tF tR tD2 5V 10 90 10 90 10 90 18V 0V 90 10 10 10 90 5V 18V 0V 0V 0V 90 2 6 7 5 4 1 8 CL 1...

Page 12: ...ge is Pb free The Pb free JEDEC designator can be found on the outer packaging for this package Note In the event the full Microchip part number cannot be marked on one line it will be carried over to...

Page 13: ...014 Microchip Technology Inc DS20001987C page 13 TC4451 TC4452 0 1 2 0 33 3 0 4 5 6 7 5 58 9 5 2 5 2 8 2 2 8 6 8 8 7 2 0 7 7 6 0 6 6 2 7 7 7 7 7 0 7 E Q D D1 H1 A A1 A2 c N e e1 b 1 2 3 L CHAMFER OPTI...

Page 14: ...01987C page 14 2006 2014 Microchip Technology Inc 2 1 2 0 2 0 1 1 0 1 2 0 33 3 0 4 77 7 5 58 9 5 2 5 2 8 6 0 8 7 8 2 7 2 7 7 2 NOTE 2 A1 A A3 NOTE 1 1 2 E N D EXPOSED PAD NOTE 1 2 1 E2 L N e b K BOTTO...

Page 15: ...2006 2014 Microchip Technology Inc DS20001987C page 15 TC4451 TC4452 0 1 2 0 33 3 0...

Page 16: ...package drawings please see the Microchip Packaging Specification located at http www microchip com packaging 1RWH Microchip Technology Drawing No C04 018D Sheet 1 of 2 HDG 3ODVWLF XDO Q LQH 3 PLO RG...

Page 17: ...to Shoulder Width E 290 310 325 Molded Package Width E1 240 250 280 Overall Length D 348 365 400 Tip to Seating Plane L 115 130 150 Lead Thickness c 008 010 015 Upper Lead Width b1 040 060 070 Lower...

Page 18: ...4451 TC4452 DS20001987C page 18 2006 2014 Microchip Technology Inc Note For the most current package drawings please see the Microchip Packaging Specification located at http www microchip com packagi...

Page 19: ...06 2014 Microchip Technology Inc DS20001987C page 19 TC4451 TC4452 Note For the most current package drawings please see the Microchip Packaging Specification located at http www microchip com packagi...

Page 20: ...TC4451 TC4452 DS20001987C page 20 2006 2014 Microchip Technology Inc 01 0 1 2 0 33 3 0...

Page 21: ...in Section 5 0 Packaging Information 3 Minor grammatical and spelling corrections Revision B March 2012 The following is the list of modifications 1 Added VDD Ramp Rate value in both DC Characteristi...

Page 22: ...Tape and Reel PA Plastic DIP 300 mil Body 8 lead OA Plastic SOIC 150 mil Body 8 lead OA713 Plastic SOIC 150 mil Body 8 lead Tape and Reel All package offerings are Pb Free Lead Free PART NO X XX Packa...

Page 23: ...hip Technology Inc in other countries GestIC is a registered trademarks of Microchip Technology Germany II GmbH Co KG a subsidiary of Microchip Technology Inc in other countries All other trademarks m...

Page 24: ...Fax 86 24 2334 2393 China Shenzhen Tel 86 755 8864 2200 Fax 86 755 8203 1760 China Wuhan Tel 86 27 5980 5300 Fax 86 27 5980 5118 China Xian Tel 86 29 8833 7252 Fax 86 29 8833 7256 China Xiamen Tel 86...

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