Microchip Technology RN4870-I/RM128, Manual, Page: 26 / 55

2016-2021 Microchip Technology Inc. DS50002489E-page 23
RN4870/71
FIGURE 4-13: RECOMMENDATIONS FOR PLACEMENT OF THE MODULE ON HOST PCB BOARD
4.5 Soldering Recommendations
The RN4870/71 Bluetooth module is assembled using
standard lead-free reflow profile, IPC/JEDEC J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following
recommendations are given:
AN233
(DS00233)
provides solder reflow recommendations
not exceed Peak Temperature (T
P
) of 250°C
reflow profile recommendations
not wash as moisture can be trapped under
the shield
flows, apply the module on the final flow
Acceptable
Best
Acceptable
Lowest
Performance