Microchip Technology PAC1921, User Manual

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PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE

2015 Microchip Technology Inc. DS50002376A-page 53
Appendix B. Bill of Materials (BOM)
TABLE B-1: BILL OF MATERIALS (BOM)
( 1 )
Qty Reference Description Manufacturer Part Number
8 C1, C5, C6,
C16, C17,
C18, C19, C20 Cap. Ceramic, 0.1 µF, 16V, 10%, X7R,
SMD, 0603 NIC Components Corp. NMC0603X7R104K16TRPF
1 C10 Cap. Ceramic, 0.47 µF, 6.3V, 10%,
X5R, SMD, 0603 Murata Electronics
®
GRM188R60J474KA01D
1 C14 Cap. Ceramic, 0.022 µF, 50V, 10%,
X7R, SMD, 0603 TDK Corporation C1608X7R1H223K
3 C2, C8, C15 Cap. Ceramic, 1 µF, 16V, 10%, X7R,
SMD, 0603 Taiyo Yuden Co., Ltd. EMK107B7105KA-T
1 C21 Cap. Ceramic, 100 pF, 50V, 1%, C0G,
SMD, 0603 TDK Corporation C1608C0G1H101F
1 C3 Cap. Ceramic, 0.001 µF, 50V, 20%,
X7R, SMD, 0603 KEMET™ C0603C102M5RAC
2 C4, C7 Cap. Ceramic, 10 µF, 10V, 20%, X5R,
SMD, 0603 Panasonic
®
ECJ-1VB1A106M
3 C9, C12, C13 Cap. Ceramic, 2200 pF, 50V, 10%,
X7R, SMD, 0603
KEMET C0603C222K5RACTU
1 D1 DIO TVSARR, ESD5V3U2U, 5.3V,
SMD, SOT-883 Infineon Technologies ESD5V3U2U-03LRH E6327
1 FB1 Ferrite, 500 mA, 0.1R, SMD, 0603 Laird-Signal Integrity LI0603E470R-10
3 J1, J2, J11 Conn. Terminal, 5.08 mm, 15A,
Female, 1x2, TH R/A On Shore Technology
Inc. EDZ250/2
1 J13 Conn. HDR-2.54, Male, 2x5, 0.100"
(2.54 mm), TH Vert. Samtec, Inc. TSW-105-07-G-D
6 J3, J4, J5, J6,
J7, J8 Conn. HDR-2.54, Male, 1x3, Tin,
5.84 MH, TH Vert. Samtec, Inc. TSW-103-07-T-S
10 JP3, JP4, JP5,
JP6, JP7, JP8,
JP9, JP10,
JP11, JP12
Mech. HW Jumper, 2.54 mm, 1x2,
Handle Gold TE Connectivity, Ltd. 881545-2
2 LD1, LD2 DIO LED Red, 1.95V, 20 mA, 220 mcd,
Clear, SMD, 0805 Kingbright Corp. APT2012SURCK
1 LD6 DIO LED Green, 2V, 30 mA, 120 mcd,
Diffuse, SMD, 0805 Avago Technologies US
Inc. HSMM-C170
1 P1 Conn. USB Mini-B Female, SMD, R/A Hirose Electric Co., Ltd. UX60SC-MB-5ST(80)
4 PAD1, PAD2,
PAD3, PAD4 Mech. HW Rubber Pad, Cylindrical,
D7.9, H5.3, Black 3M SJ61A11
2 Q1, Q2 MCHP Analog PWM Controller, 1 MHz,
MCP87050-U/MF, PDFN-8 Microchip Technology
Inc. MCP87050T-U/MF
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.