2018 Microchip Technology Inc.
DS50002834A-page 4
A.3 Board – Top Silk .......................................................................................... 29
A.4 Board – Top Copper and Silk ....................................................................... 29
A.5 Board – Top Copper .................................................................................... 30
A.6 Board – Middle Layer 1 ................................................................................ 30
A.7 Board – Middle layer 2 ................................................................................. 31
A.8 Board – Bottom Copper ............................................................................... 31
A.9 Board – Bottom Copper and Silk ................................................................. 32
A.10 Board – Bottom Silk ................................................................................... 32
Appendix B. Bill of Materials (BOM)
Appendix C. MIC23356 Internal Registers
C.1 Register MAP and I2C programmability ...................................................... 35
Worldwide Sales and Service .................................................................................... 40
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