Microchip Technology MCP43XXEV, User Manual

Page: 16 / 43

MCP43XXEV Evaluation Board User’s Guide
DS51892A-page 16
©
2010 Microchip Technology Inc.
TABLE 2-1: INSTALLED PASSIVE COMPONENTS
(2)
Component Description Comment
R11U, R17U, R20U 0
Ω
SMT 805 Pull-up resistor
R14U, R15U 10 k
Ω
SMT 805 Pull-up resistor
R7D, R13D, R18D 0
Ω
SMT 805 Pull-down resistor
(1)
U3 MCP4361-103E/ST R
AB(TYP)
= 10 k
Ω
P2, P9, P12, P19 Test Point - through-hole connector
(Orange)
J1 1x6 Male Header, 100 mil spacing 90°
angle. PICkit Serial / ICSP header
—
Blue Wire:
J1 CS/NC via to P4 via
J1 SDI/SDA via to P16 via
J1 SCK/SCL via to P5 via
J1 SDO/NC via to P6 via
See
Figure 2-2
Note 1: Whichever pin is the device’s V
DD
pin, that corresponding RXD footprint can be used for the device’s
bypass capacitor. So if Pin 8 is the device’s V
DD
pin, then install the bypass capacitor in the R8D footprint.
2: All passive components use the surface mount 805 footprint.