Bill of Materials (BOM)
©
2011 Microchip Technology Inc.
DS51994A-page 27
12
R5,R7,R11
R12,R83,R85
R86,R88,R95
R97,R98 R100
RES 1.0K OHM .1% 1/4W 0805 SMD
Susumu Co., LTD.
RGH2012-2E-P-102-B
2
R59,R60
RES 10.0 OHM 1/8W 1% 0805 SMD
Rohm Semi.
MCR10EZHF10R0
4
SW1,SW2
SW3,SW4
SWITCH TACT 6MM 230GF H=4.3MM
Omron Electronic
Components -
ECB Division
B3S-1002P
1
TP1
Wire Test Point 0.3" Length
Components Corp. PJ-202-30
1
U1
IC REG LDO 800MA 5.0V SOT-223
National Semi.
LM1117MP-5.0/NOPB
1
U3
IC REG LDO 800MA 3.3V SOT-223
National Semi.
LM1117MP-3.3/NOPB
1
U6
IC DRVR/RCVR MLTCH RS232 20TSSOP Texas Instruments
SN75C3223PWR
1
U7
"DO NOT INSTALL"
-
-
1
U9
IC ENERGY METER 28SSOP
Microchip
MCP3903
1
X2
CRYSTAL 3.579545MHZ 18PFFUND
SMD
Abracon Corp.
ABLS-3.579545MHZ-B2-T
TABLE B-1:
BILL OF MATERIALS (BOM) (CONTINUED)
Qty
Reference
Description
Manufacturer
Part Number
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.