Bill of Materials (BOM)
2020 Microchip Technology Inc.
DS50002945A-page 25
1
U2
Microchip Analog PWM Controller,
2.2 MHz, MCP1633-E/MG,
16-Lead QFN
Microchip
Technology Inc.
MCP1633-E/MG
1
U3
Microchip MCU, 8-Bit, 32 MHz,
3.5 kB, 128B, PIC12F1822T-E/SN,
8-Lead SOIC
Microchip
Technology Inc.
PIC12F1822T-E/SN
1
U4
Microchip Analog Temperature
Sensor, -40°C to +150°C,
MCP9700AT-E/TT, 3-Lead SOT-23
Microchip
Technology Inc.
MCP9700AT-E/TT
TABLE B-2:
BILL OF MATERIALS – MECHANICAL PARTS
(
Qty
Reference
Description
Manufacturer
Part Number
1
LABEL1
Label, Assembly w/Rev. Level (Small
Modules) per MTS-0002
—
—
4
PAD1, PAD2, PAD3,
PAD4
Mechanical Headers and Wires
Rubber Pad, Cylindrical, D7.9, H5.3,
Black
3M
70006431483
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-1:
MCP1633 SEPIC LED DRIVER DEMONSTRATION BOARD –
BILL OF MATERIALS (BOM)
(
1
)
(CONTINUED)
Qty
Reference
Description
Manufacturer
Part Number
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.