Micro Crystal
Ultra Small Real-Time Clock Module with SPI-Bus Interface
RV-8063-C7
October 2018
55/58
Rev. 1.1
10. SOLDERING INFORMATION
Maximum Reflow Conditions in accordance with IPC/JEDEC J-STD-
020C “Pb-free”
25
Time
Te
m
p
e
ra
tu
re
T
P
T
L
t
P
t
L
t 25°C to Peak
Ramp-up
ts
Preheat
Tsmin
Critical Zone
T
L
to T
P
Tsmax
Ramp-down
Temperature Profile
Symbol
Condition
Unit
Average ramp-up rate
(Ts
max
to T
P
)
3°C / second max
°C / s
Ramp down Rate
T
cool
6°C / second max
°C / s
Time 25°C to Peak Temperature
T
to-peak
8 minutes max
min
Preheat
Temperature min
Ts
min
150
°C
Temperature max
Ts
max
200
°C
Time Ts
min
to Ts
max
ts
60
– 180
sec
Soldering above liquidus
Temperature liquidus
T
L
217
°C
Time above liquidus
t
L
60
– 150
sec
Peak temperature
Peak Temperature
Tp
260
°C
Time within 5°C of peak temperature
tp
20
– 40
sec
