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Micro Crystal
Ultra Small Real-Time Clock Module with SPI-Bus Interface
RV-8063-C7
October 2018
49/58
Rev. 1.1
8. PACKAGE
DIMENSIONS AND SOLDER PAD LAYOUT
8.1.
RV-C7 Package:
Package dimensions (bottom view): Recommended solder pad layout:
0,4
3,2
0
,4
0
,8
2
,0
1
,5
0,9
0
,8
0,9
0
,5
0
,1
5
3,2
0,9
0,9
0,5
1
5
3
7
4
2
6
8
0
,8
m
a
x
Metal lid is connected to V
SS
(pin #2)
Tolerances: unless otherwise specified ±0.1mm
Drawing: RV-8063-C7_Pack-drw_20180918
All dimensions in mm typical.
RECOMMENDED THERMAL RELIEF
8.1.1.
When connecting a pad to a copper plane, thermal relief is recommended.
RV-C7 Package:
GOOD
P
BAD
O