MeiG Smart product technical information
SLM758
Hardware Design Guide
Page 49
4.7.Resistive Touch Interface
The module does not provide a resistive touch screen interface. If the user needs to use a
resistive touch, an external dedicated chip is required. The module can provide an I2C interface.
4.8.CapacitiveTouch Interface
The module provides a set of I2C interfaces that can be used to connect capacitive touches
while providing the required power and interrupt pins. The default interface pins for capacitive
touch software are defined as follows:
Table 4.7
：
Capacitive Touch Interface Definitions
Name
Pin
Input/Output
Description
GPIO10_TP_I2C3_SDA
234
I/O
The capacitive touch I2C
interface needs to be pulled up
toVREG_L5_1P8
GPIO11_TP_I2C3_SCL
233
I/O
GPIO65_TP_INT_N
97
I
Interrupt
GPIO64_TP_RST_N
98
O
Reset
VREG_L5_1P8
140
O
1.8V Power supply
VREG_L10_2P8_SENSOR
138
O
2.8V Power supply
Note: The interface definition of the capacitive touch can be adjusted by software, and
the user can change the GPIO and I2C according to the design needs.
4.9.Audio Interface
The module provides three analog audio inputs, MIC_IN1_P/M for the main microphone,
MIC_IN2_P for the microphone, and MIC_IN3_P for the noise reduction microphone. The
module also provides three analog audio outputs (HPH_L/R, REC_P/N, SPK_P/N). The
audio pin is defined as follows:
Table 4.8
：
Audio Pin Definitions
Name
Pin
Input/Output
Description
MIC_IN1_M
123
I
Main MIC negative, grounded at MIC
MIC_IN1_P
122
I
Main MIC positive
MIC_IN2_P
132
I
Headphone MIC positive
GND_MIC
124
I
Headphone MIC, noise reduction MIC
negative
MIC_IN3_P
131
I
Noise reduction MIC positive
MIC_BIAS1
118
O
BIAS voltage of the main MIC for silicon
wheat
MIC_BIAS2
117
O
BIAS voltage of the headphone MIC for
silicon wheat design
CDC_HPH_R
128
O
Headphone right channel
