manualshive.com logo in svg

Linx HP-3 series, Design Manual, Page: 5 / 24

Share
Download
Linx HP-3 series Design Manual Download Page 5

Page 5

The transmitter is available in two package styles. The pinned SIP style is
designed for through-hole application and has 10 pins spaced at 0.1" intervals.
Pin 1 is on the far left of the board when viewed from the front. The package may
be inserted at right angles or bent to lie down (with the cover facing up) on the
PCB. Avoid repeated bending of the pins as they may weaken and break. 

The surface-mount version is housed in a 24 pad hybrid SMD package which
has been designed to facilitate both hand and automated assembly. Pin one is
on the lower left when viewed as shown above. Castellation grooves have been
provided for ease of hand soldering and inspection. 

PHYSICAL PACKAGING

RECOMMENDED PAD LAYOUT

The following drawings illustrate the recommended circuit-board footprints for
the HP-3 series transmitter modules. Be sure to also review the physical layout
and the antenna recommendations contained elsewhere in this guide.

0.628"

0.070"

0.100"

0.060"

.060"

.3"

.10"

.060"

.030" Dia. Finished

Figure 11: Suggested PCB Footprint

Surface-Mount Transmitter

Pinned Transmitter

Figure 10: Transmitter Physical Package

ENCAPSULATION NOTICE

In some applications the designer may wish to encapsulate the product's circuit
board. Among the common reasons for doing so are environmental protection
and security. The dielectric constant of encapsulation and potting materials
varies and can adversely affect transmitter performance. For this reason, Linx
does not recommend the encapsulation of our products. Doing so will void all
product warranties. It should be noted, however, that customers have reported
success with a variety of encapsulation materials and techniques. Should you
choose to encapsulate your product, careful testing should be conducted to
determine the suitability of the chosen material.

0.178"

1.290"

0.680"

LOT 10000

1

HP  SERIES  RF  TRANSMITTER

TXM-900-HP3-PP*

0.125"

0.628"

1.260"

LOT 10000

1

HP  SERIES  RF  TRANSMITTER

TXM-900-HP3-SP*

Summary of Contents for HP-3 series

Page 1: ...tion straightforward even for engineers without prior R F experience HIGH PERFORMANCE RF MODULE TXM 900 HP3 R evised 7 2 03 FEATURES 8 parallel 100 serial PS Versions User S electable Channels Precision Frequency S ynthesized Architecture FM FS K Modulation For Outstanding Performance and Noise Immunity Transparent Analog Digital Interface High Data R ate up to 56k Wide R ange Analog Capability In...

Page 2: ...PLY Input Voltage VCC 2 8 13 0 VDC Supply Current ICC 14 17 mA 1 Power Down Current IPDN 15 µA 2 TRANSMIT SECTION Transmit Frequency Range FC 902 62 927 62 MHz 3 Center Frequency Accuracy 50 50 kHz Available Channels 8 Par 100 Ser 4 Channel Spacing 250 kHz Occupied Bandwidth 115 140 kHz Output Power 3 0 3 dBm 5 Spurious Emissions 45 dBm 6 Harmonic Emissions 60 47 dBm 6 Data Bandwidth 100 56 000 bp...

Page 3: ...nction of this device CAUTION This product incorporates numerous static sensitive components Always wear an ESD wrist strap and observe proper ESD handling procedures when working with this device Failure to observe this precaution may result in module damage or failure Figure 5 TX Powerup to Valid RX Analog Figure 3 Power Up To CTS TYPICAL PERFORMANCE GRAPHS Figure 8 Square Wave Modulation Linear...

Page 4: ...8 16V Power Down Active Low Digital Analog Input See text Inputting Digital Data CS2 Mode CTS Out GND RF ANT Out CS0 CS1 SS CLOCK CS2 SS DATA PDN CTS GND MODE Analog In Data In VCC 1 3 13 20 2 5 6 7 9 8 11 12 4 14 19 21 24 10 1 2 3 4 5 7 6 9 10 8 25K 25K 25K 100K 160K 510K 20pF 50 RF Out PDN 430K VIN SMD Pinned N C SMD Only No Connection 25K Page 4 PIN DESCRIPTION Figure 9 Pin Functions and Equiva...

Page 5: ...ayout and the antenna recommendations contained elsewhere in this guide 0 628 0 070 0 100 0 060 060 3 10 060 030 Dia Finished Figure 11 Suggested PCB Footprint Surface Mount Transmitter Pinned Transmitter Figure 10 Transmitter Physical Package ENCAPSULATION NOTICE In some applications the designer may wish to encapsulate the product s circuit board Among the common reasons for doing so are environ...

Page 6: ...me production If the recommended pad placement has been followed the pad on the board will extend slightly past the edge of the module Touch both the PCB pad and the module castellation with a fine soldering tip Tack one module corner first then work around the remaining attachment points being careful not to exceed the solder times listed below Care should be taken especially when hand soldering ...

Page 7: ...he modules themselves Shock During Reflow Transport Since some internal module components may reflow along with the components placed on the board being assembled it is imperative that the module not be subjected to shock or vibration during the time solder is liquidus Washability The modules are wash resistant but are not hermetically sealed Linx recommends wash free manufacturing techniques howe...

Page 8: ... capability This results in accurate reproduction of analog and digital content and eliminates the need for code balancing The modulated 12 00MHz reference frequency is applied to the Phase Locked Loop PLL The PLL combined with a 902 928MHz VCO forms a stable frequency synthesizer that can be programmed to oscillate at the desired transmit frequency An on board micro controller manages the PLL pro...

Page 9: ...the transmitter to the antenna should be kept as short as possible For runs greater than 1 4 inch use 50 ohm coax or a 50 ohm microstrip transmission line as shown below Handy software for calculating microstrip lines is available on the Linx website www linxtechnologies com The typical output power of the HP 3 transmitter is right at Part 15 limits Sometimes it is necessary to slightly attenuate ...

Page 10: ...ernal channel selection lines parallel mode or serial channel input serial mode and sets the frequency synthesizer to the appropriate channel Figure 3 on page 3 shows the typical turn on response time for an HP 3 transmitter When the frequency synthesizer has locked on to the proper channel frequency the circuit is ready to accept data This is acknowledged by the CTS line transitioning high The mo...

Page 11: ...25µs T2 5µs T3 8µs T4 5µs Data Clock T0 1ms T0 Minimum time between packets or prior to data startup 1mS min T1 Data LO Clock HI to Data LO Clock LO 25µS min T2 Clock LO to Clock HI 5µS min T3 Clock HI to Clock LO 8µS min T4 Data HI Clock HI 5µS min Total Packet Time 157µS min 1 Loading begins when clock line is high and data line is taken low 2 Ensure that the edge is fully risen prior to the hig...

Page 12: ... to the DATA pin determines the carrier deviation distortion can occur if the DATA pin is over driven The actual level of the input waveform should be adjusted to achieve optimum in circuit results for your application The illustration above shows the simplicity of transmitting audio with the HP 3 transmitter In applications where higher audio quality is required an external compandor such as a Ph...

Page 13: ...always important to think of an RF link as a total system taking into account both the transmitter and receiver characteristics The incoming data must not only be compatible with the transmitter but also within the capability of the receiver to reproduce it For example if the transmitter were sending a 255 0FF hex continuously the receiver would view the stream of high bits as a DC level The recei...

Page 14: ... in any manner This transparency gives the designer tremendous flexibility in the structure of a protocol Of course the performance and reliability of the link are dependent on the quality of external software and hardware To properly apply the transmitter it is critical to understand the differences between a wired and a wireless environment At each point in the system there are timing and data c...

Page 15: ...ent will be lost There are two major timing considerations the engineer must be aware of when designing with the HP 3 Series transmitter These are shown in the table below Remember the stated timing parameters assume a stable supply of 2 8 volts or greater They do not include the charging times of external capacitance on the module s supply lines the overhead of external software execution or powe...

Page 16: ...e but its effects can be minimized by better understanding its characteristics Interference can manifest itself in many ways Low level interference will produce noise and hashing on the output and reduce the link s overall range Thanks to the capture properties of an FM system the receiver will still function when an intended signal is present at a higher level than the interference Another type o...

Page 17: ...a surface area the overall length of the 1 4 wave radiating element and be oriented at a 90 angle Such an orientation is often not practical due to size and configuration constraints In these instances a designer must make the best use of the area available to create as much groundplane in proximity to the base of the antenna as possible In instances where the antenna is remotely located or the an...

Page 18: ...ailable to the general public In cases where the antenna needs to be removable Linx offers a full line of connectors designed to comply with these requirements Figure 26 Linx Antennas Figure 27 Linx Connectors ANTENNA SHARING In cases where a transmitter and receiver module are combined to form a transceiver it is often advantageous to share a single antenna To accomplish this an antenna switch mu...

Page 19: ...o care must be exercised in layout and placement A loop or trace style antenna is normally printed directly on a product s PCB This makes it the most cost effective of antenna styles The element can be made self resonant or externally resonated with discrete components but its actual layout is usually product specific Despite its cost advantages PCB antenna styles are generally inefficient and use...

Page 20: ...he product may require at the same time such as UL CLASS A B etc Once your completed product has passed you will be issued an ID number which is then clearly placed on each product manufactured Questions regarding interpretations of the Part 2 and Part 15 rules or measurement procedures used to test intentional radiators such as the HP 3 modules for compliance with the Part 15 technical standards ...

Page 21: ...unusual for a high volume component manufacturer These services along with an exceptional level of technical support are offered because we recognize that RF is a complex science requiring the highest caliber of products and support Wireless Made Simple is more than just a motto it s our commitment By choosing Linx as your RF partner and taking advantage of the resources we offer you will not only...

Page 22: ... 873 42 73 920 87 886 17 23 908 37 873 67 74 921 12 886 42 24 908 62 873 92 75 921 37 886 67 25 908 87 874 17 76 921 62 886 92 26 909 12 874 42 77 921 87 887 17 27 909 37 874 67 78 922 12 887 42 28 909 62 874 92 79 922 37 887 67 29 909 87 875 17 80 922 62 887 92 30 910 12 875 42 81 922 87 888 17 31 910 37 875 67 82 923 12 888 42 32 910 62 875 92 83 923 37 888 67 33 910 87 876 17 84 923 62 888 92 3...

Page 23: ... 50 12 5 030 2 57 55 33 44 67 4 419 2 20 60 19 39 81 3 946 1 90 64 52 35 48 3 570 1 65 68 38 31 62 3 010 1 26 74 88 25 12 2 615 0 97 80 05 19 95 2 323 0 75 84 15 15 85 2 100 0 58 87 41 12 59 1 925 0 46 90 00 10 00 1 433 0 14 96 84 3 16 1 222 0 04 99 00 1 00 1 119 0 01 99 68 0 32 1 065 0 00 99 90 0 10 1 034 0 00 99 97 0 03 1 020 0 00 99 99 0 01 MISMATCH CONVERSION TABLE NOTES ...

Page 24: ...the suitability of any product for use in a specific application None of these devices is intended for use in applications of a critical nature where the safety of life or property is at risk The user assumes full liability for the use of product in such applications Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any applicatio...

Reviews:

No comments