Linear Technology Dust Networks Eterna LTP5901 Integration Manual Download Page 3

 

 

 

 

E

TERNA 

LTP5901

 AND 

LTP5902

 

I

NTEGRATION 

G

UIDE

  

About This Guide 

This document provides the design guidelines essential for incorporating either an Eterna 
LTP5901 or LTP5902 module.  The document covers design, layout, EMI, and some 
manufacturing considerations. 

Audience 

This document is intended for system developers, hardware designers, and layout engineers. 

Related Documents 

The following related documents are available: 

Eterna Serial Programmer Guide

 

ETERNA2 User’s Guide

 

 

Conventions and Terminology 

This guide uses the following text conventions: 

 

Computer type

 

indicates information that you enter, such as a URL. 

 

Bold type

 indicates buttons, fields, and menu commands. 

 

Italic type is used to introduce a new term. 

 

Note:

  Notes provide more detailed information about concepts. 

 

Caution:

 

 

Cautions advise about actions that might result in loss of data. 

 

Warning: 

Warnings advise about actions that might cause physical harm to the hardware 

or your person. 
 

Revision History 

Revision Date  Description 

040-0119 rev 1 

6/7/2012 Initial 

version 

040-0119 rev 2 

7/18/2012 Updated 

references 

040-0119 rev 3 

8/20/2012 

Corrected keep out for LTP5901 land pattern 

040-0119 rev 4 

4/2/2013 

Added support documentation for external SRAM. 

040-0119 rev 5 

5/8/2013 

Added hyper link to programmer. 

040-0119 rev 6 

10/24/2013 

Update SDRAM schematics and BOM 

 

Summary of Contents for Dust Networks Eterna LTP5901

Page 1: ...Dust Networks Eterna LTP5901 LTP5902 Integration Guide...

Page 2: ...nd Pattern MMCX 11 Antenna ESD Considerations 13 Supply Design 13 Voltage Supervision and Reset 13 2 Manufacturing Guidelines 14 Reflow 14 Solder Paste Cleaning 14 Packaging 14 List of Figures Figure...

Page 3: ...indicates information that you enter such as a URL Bold type indicates buttons fields and menu commands Italic type is used to introduce a new term Note Notes provide more detailed information about c...

Page 4: ...hown in Figure 1 includes the signal connections necessary for the programming header The part number for the header is provided in Table 1 Figure 1 Table 1 Eterna Example Schematic Programming Header...

Page 5: ...IPRC requires the use of external RAM The LTC5800 IPRB supports networks of up to 100 motes and has a maximum throughput of 36 packets per second The LTP5901 LTP5902 IPRB requires the use of external...

Page 6: ...2 RESERVED 23 RESERVED 24 EB_DATA_7 25 EB_DATA_6 26 EB_DATA_4 27 EB_DATA_0 28 UARTC0_TX EB_IO_LE0 31 UARTC0_RX EB_DATA_1 32 EB_IO_LE2 38 IPCS_MISO 33 EB_ADDR_1 40 IPCS_MOSI 35 EB_ADDR_0 41 IPCS_SCK 36...

Page 7: ...VSUPPLY_M eb_io_wen eb_data_5 eb_data_4 eb_addr_6 eb_data_3 eb_data_7 eb_data_6 Pulse Generator Circuits eb_addr_5 eb_addr_4 eb_io_le2 VSUPPLY_M R13 0 0201 eb_data_1 eb_data_0 eb_addr_16 eb_addr_14 e...

Page 8: ...terna modules include exposed test points and pads on the bottom mounting side of the PCB Exposed metal should be avoided in the on the top surface of the mating PCB in the area where the module will...

Page 9: ...sk Defined NSMD and Solder Mask Defined SMD Given the lead pitch of the LTP5901 and that tolerances for metal etch are commonly more precise than solder mask deposition it is recommended to use NSMD l...

Page 10: ...10 ETERNA LTP5901 AND LTP5902 INTEGRATION GUIDE LTP5901 Land Pattern Chip Antenna Figure 4...

Page 11: ...the lead pitch of the LTP5902 and that tolerances for metal etch are commonly more precise than solder mask deposition it is recommended to use NSMD land patterns The solder mask opening should provid...

Page 12: ...12 ETERNA LTP5901 AND LTP5902 INTEGRATION GUIDE LTP5902 Land Pattern MMCX Figure 5...

Page 13: ...to ESD events individual implementations may have unique factors that complicate ESD protection Supply Design Due to the heavy duty cycling Eterna s current consumption can change substantially over...

Page 14: ...llowing the soldering process Cleaning the populated modules is strongly discouraged due to the potential issues that may result Residuals under the module are difficult to remove with any cleaning pr...

Page 15: ...t personal injury to the user or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or sys...

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