- 14 -
LGE Internal Use Only
Copyright © 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
FM- radio
Digital -
Microphone
ARM1176
RAM
ROM
cache
External
Memory-IF
USIF
Measurement
IF (A/D)
SD/ MMC
SIM
GSM
TEAKLite
RF
Control
GSM
Cipher
GPTU
I² S / DAI
IR - Memory
Loud -
speaker
MicSupply
generation
HSR
HSL
EPP
EPN
LSP
LSN
MICP1
MICN1
MICP2
MICN2
Mic
MUX
VMIC
VUMIC
16 Ohm
100 mW
8 Ohm
700 mW
2x 16 Ohm
2x 30 mW
Stereo
Headset
Earpiece
Charge Pump
( negative voltage for
bipolar audio out )
VMMC
VANA
LPMU
VUSB
LAUX
Charge
DC/ DC
Buck
Vibrator
64 - bit bus
32 - bit bus
IF
GMSK
DAC
SD
PLL
FEM
32 kHz
XO
DSP
ADC
PA
csi
M
Low -
Power
DCXO
RF PMU
USB 2.0
FS
CIF
DCC
Keypad
4k 7
0 . 15 5 %
1.8V
~2 .5V
VCHARGE 4. 5 V … 20V
2T
A
BV
NE
SN
ES
PE
SN
ES
S
C
C
SB
G
H
C
D
DV
T
N
H
SV
BC 847 S
1
2
6
4
5
3
for example
ZXTP 25020
min.
10 µF
( 0 V ) 3.05 V … 5 .1 V (6 V)
0
02
>e
f
h
T 1
A
m
5.1.
xa
m
7.5 µA
135 mV …
600mV
G
H
C
V
4 k3
127 k
470
1.0V…
1,8V
Vcore
LRTC
LSIM
Back -
light
LDO blocking caps, 100nF
DC/ DC
Battery Charger
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 215 Hardware Block Diagram