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SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.

General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC

power source before;
a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first

connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.

4. Do not spray chemicals on or near this receiver or any

of its assemblies.

5. Unless specified otherwise in this service manual,

clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks

with which receivers covered by this service manual
might be equipped.

7. Do not apply AC power to this instrument and/or any of

its electrical assemblies unless all solid-state device
heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the

receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. 
Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or

unsolder ES devices.

4. Use only an anti-static type solder removal device.

Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.

5. Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES
devices.

6. Do not remove a replacement ES device from its

protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).

7. Immediately before removing the protective material

from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting  of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

Summary of Contents for L1950B

Page 1: ...www LGEservice com techsup html CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL CHASSIS NO CL 83 MODEL L1750B L1750B SFN AN QP L1750B L1750B BFN AN EP L1950B L1950B SFN AX QP L1950B L1950B BFN AX EP Same model for Service To apply the MSTAR Chip ...

Page 2: ...ng Chart 3 1 Sync Signal Type Separate Sync Digital SOG Sync On Green 3 2 Video Input Signal 1 Type R G B Analog 2 Voltage Level 0 0 7 V a Color 0 0 0 Vp p b Color 7 0 0 35 Vp p c Color 15 0 0 7 Vp p 3 Input Impedance 75 Ω 3 3 Operating Frequency Horizontal Analog 30 83kHz Horizontal Digital 30 71kHz Vertical 56 75Hz 4 MAX RESOLUTION D sub Analog 1280 x 1024 75Hz DVI Digital 1280 x 1024 60Hz 5 POW...

Page 3: ... Sync T M D S Data1 T M D S Data1 T M D S Data1 3 Shield T M D S Data3 T M D S Data3 5V Power Ground return for 5V H Sync and V Sync Pin Signal DVI D 1 8 9 17 24 16 16 17 18 19 20 21 22 23 24 Hot Plug Detect T M D S Data0 T M D S Data0 T M D S Data0 5 Shield T M D S Data5 T M D S Data5 T M D S Clock Shield T M D S Clock T M D S Clock T M D S Transition Minimized Differential Signaling DVI D Connec...

Page 4: ... Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty pl...

Page 5: ...st receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices ...

Page 6: ...tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coati...

Page 7: ...onnection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on t...

Page 8: ...0 640 x 480 V 75 500 480 1 3 16 5 H 40 0 37 879 1056 800 40 128 88 800 x 600 V 60 317 628 600 1 4 23 6 H 49 5 46 875 1056 800 16 80 160 800 x 600 V 75 0 625 600 1 3 21 7 H 57 283 49 725 1152 832 32 64 224 832 x 624 V 74 55 667 624 1 3 39 8 H 65 0 48 363 1344 1024 24 136 160 1024 x 768 V 60 0 806 768 3 6 29 9 H 78 75 60 123 1312 1024 16 96 176 1024 x 768 V 75 029 800 768 1 3 28 10 H 100 0 68 681 14...

Page 9: ...oor Remove tape from metal frame Remove the 6 screws from each up of metal frame 2 3 4 5 6 Remove Al tape from control pcb fix Remove the 4 screws from each side of metal frame 1 Pull the front cover upward 2 Then let the all latches are separated 3 Put the front face down 7 8 ...

Page 10: ...DC LVDS SCALER INPUT SWITCHING TMDS MTV312 MICOM LCD Module R G B differential LIPS 5V 5V AC I nput TSU56AL TR KTA 1273 12V DVI D R G B H V Sync Digital Signal 1 8V 3 3V 1 8V 3 3V1 3 3V Reg 78D33 5V 3 3V LVDS Low Voltage Differential Signaling ...

Page 11: ...alog to digital interpolates input to 1280 X 1024 resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the 3 3V regulator to convert power which is provided 12V 5V in Power board 5V is provided for MICOM and LCD panel 5V is converted 3 3V by regulator and 3 3V is converted 1 8V by scaler KTA1273 Converted power is provided for IC in the main board 3 MI...

Page 12: ...h a bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achive the dc output sta...

Page 13: ... is available to LCD Monitor only 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe c Remove all default number d Add 300 3FF e Click Start button f Click Exit button 2 EDID Read Write 1 Run WinEDID exe 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button c Click Write button ...

Page 14: ...display 2 Wait for about 5 seconds and press MENU POWER switch with 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a Auto Color W B balance and Automatically sets the gain and offset value b NVRAM INIT EEPROM initialize 24C08 c CLEAR ETI To initialize using time d AGING Select Aging mode on off e R G B 9300K Allows you to set the R G B 9300...

Page 15: ...CK U201 NO NO NO CHECK POWER BOARD AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE CHECK 5VS LINE OPEN CHECK CHECK 3 3V LINE NO CHECK X TAL YES YES YES YES CHECK J705 VOLTAGE PIN5 PIN6 5V CHECK U501 PIN 8 VOLTAGE 5V IS U201 PIN90 3 3V VOLTAGE CHECK U201 PIN 96 PULSE 1 NO PROBLEM 1 Waveforms U201 96 ...

Page 16: ...ARD AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE CHECK MICOM INV ON OFF PORT 1 CONFIRM BRIGHTNESS OSD CONTRL STATE 2 CHECK MICOM DIM ADJ PORT LIPS YES YES YES YES J705 PIN5 PIN6 5V J705 PIN9 2 5V J705 PIN10 5V CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL CONTACT PROBE TO CAUTION LABEL CAN YOU SEE PULSE AT YOUR SCOPE ...

Page 17: ... NO TROUBLE IN CABLE OR LCD MODULE CHECK U801 17 19 CHECK U803 15 1 CHECK PIN122 123 SOLDERING CONDITION 2 CHECK X501 3 TROUBLE IN U201 CHECK CONNECTION LINE FROM D SUB TO U501 YES YES YES U201 PIN 18 90 3 3V U201 PIN96 97 OSCILLATE AS 12MHZ U501 PIN43 IS 48KHz H SYNC PIN44 IS 60Hz V SYNC IS PULSE APPEARED AT SIGNAL PINS AT MODE 12 1 2 ...

Page 18: ...DPM TROUBLE IN DPM NO NO TROUBLE IN U501 CHECK PC PC IS NOT GOING INTO DPM OFF MODE CHECK H V SYNC LINE YES YES CHECK R216 R217 R778 R781 CHECK U501 PIN 43 44 SYNC PULSE 3 3 Waveforms R216 R778 H Sync 3 R217 R781 V Sync ...

Page 19: ...WIRING DIAGRAM 19 Connector Ass y P N 6631T11012W or 6631T11020W Connector Ass y P N 6631T11017X L1750B 6631T11017Y L1950B Connector Ass y P N 6631T20023A or 6631T20034M ...

Page 20: ...EXPLODED VIEW 20 010 040 050 020 070 080 090 100 120 030 110 060 ...

Page 21: ...LG PHILPS TFT COLOR P4 645CH 300NITS TN 8MS LPL KUMI PB FREE EGI NEC S D IC SXGA LVDS 3809TKL100B BACK COVER ASSEMBLY L1750B L100 ABS350 9930 BK SILVER 3809TKL100F BACK COVER ASSEMBLY L1750H L100 PC ABS 9930 BK DUAL US VER BLACK 3809TKL101B BACK COVER ASSEMBLY L1950H L101 BRAND ABS350 9930 BK SILVER 3809TKL101D BACK COVER ASSEMBLY L1950H L101 BRAND ABS350 9930 BK B C SKD 3809TKL101L BACK COVER ASS...

Page 22: ...608 50V 10 R TP X7R C738 0CK104CK56A 0 1UF 1608 50V 10 R TP X7R C743 0CK104CK56A 0 1UF 1608 50V 10 R TP X7R DATE 2005 07 07 S AL LOC NO PART NO DESCRIPTION SPECIFICATION C744 0CC680CK41A 68PF 1608 50V 5 R TP NP0 C803 0CE107EF610 100UF KMG RD 16V 20 FL BULK C805 0CK104CK56A 0 1UF 1608 50V 10 R TP X7R L1750B C809 0CK103CK51A 0 01UF 1608 50V 10 R TP B Y C812 0CE107EF610 100UF KMG RD 16V 20 FL BULK C8...

Page 23: ...P R727 0RJ1002D677 10K OHM 1 10 W 5 1608 R TP R728 0RJ0222D677 22 OHM 1 10 W 5 1608 R TP R729 0RJ0222D677 22 OHM 1 10 W 5 1608 R TP R730 0RJ1000D677 100 OHM 1 10 W 5 1608 R TP R731 0RJ4700D677 470 OHM 1 10 W 5 1608 R TP R737 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP R744 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP R747 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP R751 0RJ4700D677 470 OHM 1 10 W 5 1608 R TP DATE...

Page 24: ...SCHEMATIC DIAGRAM 24 1 TSU56AL TSU16AL 1 Waveforms U201 96 97 3 R216 R778 H Sync 3 R217 R781 V Sync 1 3 ...

Page 25: ... 25 2 MICOM 2 U501 43 H SYNC 2 U501 44 V SYNC Waveforms 2 ...

Page 26: ... 26 3 POWER ...

Page 27: ... 27 4 CONNECTOR JACKS 3 Waveforms R216 R778 H Sync 3 R217 R781 V Sync 3 ...

Page 28: ...Nov 2005 P NO 38289S0033R Printed in Korea ...

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