3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ
ͽͶ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑ΟΝΪ
32/110
Figure 3.3.2 Band SW Logic Table
Figure 3.3.3 FEM CIRCUIT DIAGRAM
3. TECHNICAL BRIEF
The output of each PA block and the outputs to the two receive pads are connected to the antenna pad
through PHEMT RF switches and a diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive
components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic
over mold.
100
R405
R402
100
SW401
G2
ANT
RF
G1
DNI
C420
100
R403
VBAT
2.2nH
2.2nH
1.5n
1.2p
C421
DNI
1n
C409
39p
C411
33
32
31
05
94
84
74
64
45
44
43
42
41
40
93 83 73
61 51 41 31 21 11 01
63 53 43
17
9
18
8
19
7
20
6
21
5
22
4
23
3
24
2
52 62 72 82 92 03
1
GND1
02
D
N
G
91
D
N
G
81
D
N
G
71
D
N
G
61
D
N
G
51
D
N
G
GND2
GND14
DCS_TX
ANT
GND3
GND10
GSM_TX
GND9
GND4
GND8
VBATT
GND7
GND5
RSVD2
VLOGIC
GSM_RX
4
D
N
G
P
5
D
N
G
P
6
D
N
G
P
P
M
A
R
V
N
E_
XT
S
B
D
V
S
R
6
D
N
G
X
R_
S
C
D
1
D
V
S
R
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P
PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
61
D
N
G
P
71
D
N
G
P
81
D
N
G
P
91
D
N
G
P
02
D
N
G
P
PGND1
PGND2
PGND3
942.5 MHz,35 MHz
10
5
3
2
6
4
7
8
9
1 I1
O1_1
O1_2
O2_1
I2
O2_2
1
G
2
G
3
G
4
G
1n
C416
1K
R404
C410
1n
C412
33n
C413
10n
C405
DNI
ANT402
ANT401
RF_VLOGIC
RF_BS
RF_DCSPCS_OUT
RF_GSM_RXP
RF_GSM_RXN
RF_DCS_RXP
RF_DCS_RXN
RF_GSM_OUT
RF_TX_EN
RF_V_RAMP
ANT_FEED
ANT_FEED
CHANGE THIS DUAL SAW FILTER
10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP
TO PART_NO SMRH0005901(SKY77543)
IN CASE OF GSM850/PCS1900
CHANGE THIS MODULE
IN CASE OF GSM850/PCS1900
TO PART_NO SFSB0001301(B9506)
Change to 850 SMT
ECZH0000806
ELCH0003834
ECZH0000806
5pF
5pF
4.3nH
L402
C404
C403