THERMAL
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Power Block
14/10/09
LS33B
+3.3V_NORMAL
Q509
AO3435
G
D
S
C535
2.2uF
10V
C531
0.039uF
50V
10uF
C505
10V
R557
10K
C528
0.1uF
16V
+3.3V_NORMAL
R518
200
1/16W
1%
+13V
Q507
MMBT3904(NXP)
E
B
C
R544
20K
1%
+3.3V_NORMAL
C523
10uF
10V
OPT
ZD504
2.5V
+5V_NORMAL
R516
4.7K
OPT
PANEL_CTL
IC505
TPS5432DDAR
3
PH
2
VIN
4
GND
1
BOOT
5
VSENSE
6
COMP
7
EN
8
SS
9
[EP]GND
R558
22K
10uF
C508
10V
R551
10K
+13V
R519
4.7K
C538
22uF
10V
USB1_CTL
+3.3V_NORMAL
Q508
MMBT3904(NXP)
E
B
C
R522
10K
R549
4.7K
OPT
L508
CB2012PK501T
R563
5.6K
C533
0.33uF
16V
C524
22uF
10V
C525
270pF
50V
R542
100K
+1.5V_DDR
C537
0.1uF
16V
C515
10uF
10V
R556
10K
+5V_USB1
C517
82pF
50V
R545
47K
1%
POWER_ON/OFF_1
L505
CB2012PK501T
USB1_OCD
+3.5V_ST
C530
0.01uF
IC503-*1
APX803D29
RESET_IC_DIODES
1
GND
3
VCC
2
RESET
R523
0
L507
4.7uH
C506
100pF
50V
OPT
R552
10K
C526
10uF
10V
+13V
+3.3V_NORMAL
C520
0.1uF
16V
OPT
+3.5V_ST
C536
10uF
16V
READY
R517
1K
1/16W
1%
POWER_DET
IC503
BD48K28G
RESET_IC_ROHM
1
GND
2
VOUT
3
VDD
C522
22uF
10V
+3.5V_ST
R555
10K
L502
BLM18PG121SN1D
C527
0.1uF
16V
R547
100
C534
0.1uF
25V
OPT
+1.10V_VDDC
ZD503
2.5V
R532
18K
1%
TPS65282REGR
IC502
1
EN
3
SS
7
FAULT2
9
SW_OUT2
10
RLIM
11
AGND
12
SW_OUT1
13
SW_IN_1
14
SW_IN_2
15
FB
16
LX_1
17
LX_2
18
BST
19
PGND_1
20
PGND_2
21
VIN_1
22
VIN_2
23
PGOOD
24
V7V
5
EN_SW2
8
FAULT1
6
EN_SW1
4
ROSC
2
COMP
25
[EP]GND
R550
2.7K
1%
C507
4700pF
50V
PANEL_VCC
L510
UBW2012-121F
120OHM
R521
100K
OPT
C529
0.1uF
16V
C532
390pF
50V
IC501
EAN62868801
ADJ/GND
OUT
IN
R520
0
OPT
L511
BLM18PG121SN1D
C521
0.1uF
16V
L509
3.6uH
R526
15K
5%
R559
2.2K
C514
0.047uF
25V
R533
3.3K
1%
C519
22uF
10V
+3.5V_ST
P2300
SMAW200-H12S5K(BK)(LTR)
9
GND
4
D13V
8
A13V
3
GND
12
PDIM1
7
A13V
2
PDIM2
11
DRV_ON
6
D13V
1
PWR_ON
10
GND
5
D13V
13
.
C6001
0.1uF
50V
R7003
100
C8006
0.1uF
50V
+3.3V_NORMAL
R7002
1K
R7108
100
L6001
UBW2012-121F
Q2300-*1
MMBT3906(NXP)
NXP_RL_ON_TR
E
B
C
PWM1
L6002
UBW2012-121F
RL_ON
+13V_A
R7107
100
+13V
INV_CTL
R2301
10K
VA8011
20V
VA7004
20V
PWM2
R536
14K
1%
R537
5.1K
1%
C516
0.1uF
25V
+3.5V_POWER_DET
R540
0
OPT
USB2_OCD
R528
10K
+5V_USB2
USB2_CTL
R529
4.7K
OPT
+13V
R
7
1
1
4
5
1
K
1
%
R7117
33K
1%
C7046
10pF
50V
+3.5V_ST
C7038
0.1uF
25V
IC7003
TPS563200
3
VIN
2
SW
4
VFB
1
GND
6
VBST
5
EN
L7006
BLM18PG121SN1D
R7116
150K
1%
C7039
22uF
10V
C7040
22uF
10V
C7044
0.1uF 16V
C7037
10uF
25V
R7109
10K
R9022
3.9K
R9023
3.9K
Q2300
2N3906S-RTK
KEC_RL_ON_TR
E
B
C
R9036
10K
R9037
10K
Q2302
MMBT3904(NXP)
E
B
C
+3.5V_ST
+3.5V_POWER_DET
R9038
0
Q510
SSM3J332R
S
G
D
C511
10uF
25V
10uF
25V
C509
R9039
10K
POWER_ON/OFF_1
VA8012
ADMC 5M 02 200L
Q2303
MMBT3904(NXP)
E
B
C
R9042
10K
R9043
10K
R9044
10K
OPT
R9032
4.7K
+3.5V_ST
R9045
33K
OPT
L7008
2.2uH
VLS5045EXT-2R2N
ZD505
5.6V
C809
10uF
25V
OPT
Q501
MMBT3904(NXP)
E
B
C
C502
10uF
16V
R560
100K
C501
2.2uF
16V
R561
27K
R501
4.7K
C503
10uF
16V
READY
R562
5.6K
R2
+5V_Normal & +5V_USB with OCP
R2
4A
R1
Vout=1.25*(1+R2/R1)+Iadj*R2
1.3A
Vout=0.8*(1+R1/R2)
3A
PANEL_VCC
+1.10V_VDDC
R1
+3.3V_Normal
Power_DET
+1.5V_DDR
Vout=0.808*(1+R1/R2)
R2
R1
Parts No.501~600
L14 POWER BlOCK
Now apply DIODES
’15 FHD POWER
R1
+3.5V_ST
3A
R2
Vout=0.765*(1+R1/R2)
TO IMPROVE DEEP OF PANEL_VCC
TO IMPROVE RISING TIME OF PANEL_VCC
20141224
20141224
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Summary of Contents for 32SE3B
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