Lantronix Open-Q 845 mSOM User Manual Download Page 31

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3: Open-Q 845 µSOM Development Kit

Open-Q 845 µSOM Development Kit User Guide

For more details regarding configuring the GPIOs on this header, refer to the Open-Q 845 Software

Release Notes to determine feature support in the latest software release.

3.7.18 Audio Inputs Expansion Header J1900 (27)

The Open-Q 845 µSOM Development Kit audio subsystem is built around the Qualcomm Audio Codec

WCD9340 (28). The Audio Inputs Expansion Header J1900 exposes some of the audio input capabilities

of WCD9340 for the user. See item 27 in Figure 1 for the carrier board location of this header. The

pinout for this header is shown in the table below.

Table 13. Audio Inputs Expansion Header Pinout J1900

Pin

Signal

Description

Pin

Signal

Description

CDC_IN1_P

Codec Input 1 Positive

CDC_IN1_N

Codec Input 1 Negative

CDC_IN3_P

Codec Input 3 Positive

CDC_IN3_N

Codec Input 3 Negative

CDC_MIC_BIAS1

Microphone Bias 1

CDC_MIC_BIAS3

Microphone Bias 3

CDC_IN4_P

Codec Input 4 Positive

CDC_IN4_N

Codec Input 4 Negative

CDC_MIC_BIAS4

Microphone Bias 4

MB_VREG_3P3

Carrier board switching

reg3.3V

GND

System Ground

GND

System Ground

CDC_DMIC_CLK0

Digital Microphone 0 Clock

CDC_DMIC_CLK1

Digital Microphone 1 Clock

CDC_DMIC_DATA0

Digital Microphone 0 Data

CDC_DMIC_DATA1

Digital Microphone 1 Data

VREG_S4A_1P8

µSOM LDO Regulator S4A

+1.8V

CDC_DMIC_CLK2

Digital Microphone 2 Clock

GND

System Ground

CDC_DMIC_DATA2

Digital Microphone 2 Data

VREG_LVS2A_1P8

µSOM low voltage

switch LVS2 +1.8V

VREG_L19A_3P0

µSOM LDO L19A

+3.0V

GND

Ground

10 GND

Ground

11 GPIO122_HRM_INT

CPU GPIO122

12 GPIO125_TS_INT_N

CPU GPIO125

13 SSC6_QUP1_4_SPI1_CS1_N

CPU Sensor Core

SSC_GPIO6

14 GPIO120_ALSP_INT_N

CPU GPIO120

15 GPIO62_QUA_MI2S_DATA2

CPU GPIO62

16 GPIO119_MAG_INT_N

CPU GPIO119

17 No Net

18 GPIO124

CPU GPIO124

19 SSC5_QUP1_3_SPI1_CS0_N

CPU Sensor Core

SSC_GPIO5

20 SSC3_QUP1_1_SPI1_MOSI

CPU Sensor Core

SSC_GPIO3

21 SSC4_QUP1_2_SPI1_CLK

CPU Sensor Core

SSC_GPIO4

22 SSC2_QUP1_0_SPI1_MISO

CPU Sensor Core

SSC_GPIO2

23 No Net

24 SSC7_QUP1_5_SPI1_CS2_N

CPU Sensor Core

SSC_GPIO7

Summary of Contents for Open-Q 845 mSOM

Page 1: ...Open Q 845 µSOM Development Kit User Guide Part Number PMD 00015 Revision A July 2020 ...

Page 2: ... trademark of Lantronix Inc registered in the United States and other countries Intrinsyc is a trademark of Intrinsyc Technologies Corporation registered in Canada and other countries Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated registered in the United States and other countries Qualcomm SDA845 is a product of Qualcomm Technologies Inc and or its subsidiaries Other product and ...

Page 3: ...2019 Document title Open Q 845 µSOM Development Kit User Guide Intrinsyc document number ITC 01DEV1430 UG 001 July 2020 A Initial Lantronix document Added Lantronix document part number Lantronix logo branding contact information and links For the latest revision of this product document please go to http tech intrinsyc com ...

Page 4: ...dling Procedures ________________________________________ 10 3 4 Development Kit Contents ____________________________________________ 10 3 4 1 Important Locations ______________________________________________ 11 3 4 2 Block Diagram___________________________________________________ 13 3 4 3 Optional Accessories _____________________________________________ 14 3 5 Getting Started ________________...

Page 5: ...__ 28 3 7 15 Mini PCIe Card Connector J2801 24 _______________________________ 28 3 7 16 Digital IO Expansion Header J2200 23 _____________________________ 29 3 7 17 Sensor IO Expansion Header J2100 21 _____________________________ 30 3 7 18 Audio Inputs Expansion Header J1900 27 ___________________________ 31 3 7 19 Audio Outputs Expansion Header J1901 26 _________________________ 32 3 7 20 Audio...

Page 6: ...st of Development Kit Features itemized in the figure above 12 Table 2 Carrier Board Features 16 Table 3 Boot Configuration DIP Switch Settings 18 Table 4 Battery ID Thermistor Configuration DIP Switch Settings 19 Table 5 Battery Connector J300 Pinout 20 Table 6 Power Header J301 Pinout 21 Table 7 Power Header J700 36 22 Table 8 Development Kit Buttons 7 24 Table 9 Development Kit LEDs 36 24 Table...

Page 7: ...ther Lantronix development kits on the Lantronix web site http www lantronix com products 1 2 Scope This document will cover the following items on the Open Q 845 µSOM Development Kit Block Diagram and Overview Hardware Features Configuration SOM Carrier Board Available peripherals 1 3 Intended Audience This document is intended for users who would like to develop custom applications on the Lantro...

Page 8: ...heet R 2 Open Q 845 µSOM Carrier Board Design Guide R 3 Open Q 845 µSOM Schematics SOM and Carrier R 4 Open Q 845 µSOM Development Kit Display Adapter Design Guide R 5 Open Q 845 µSOM Development Kit Camera Adapter Design Guide R 6 Open Q 845 µSOM Development Kit Battery Charging Tech Note 2 3 Terms and Acronyms Term and acronyms Definition AMIC Analog Microphone ANC Audio Noise Cancellation B2B B...

Page 9: ... Peripheral Serial interfaces like UART SPI I2C UIM RF Radio Frequency SATA Serial ATA SLIMBUS Serial Low power Inter chip Media Bus SOM System on Module SPMI System Power Management Interface Qualcomm PMIC baseband proprietary protocol SSBI Single wire serial bus interface Qualcomm proprietary mostly PMIC Companion chip and baseband processor protocol UART Universal Asynchronous Receiver Transmit...

Page 10: ...plicable for Radio devices being placed on the market FCC equipment authorization rules or other regulations pertaining to consumer devices being placed on the market for use by the general public This development platform may only be used in a controlled user environment where operators have obtained the necessary regulatory approvals for experimentation using a radio device and have appropriate ...

Page 11: ... o AC power adapter 3 4 1 Important Locations The diagram below shows the locations of key components interfaces and controls 2 1 4 3 29 30 34 5 8 9 10 11 12 7 13 14 17 20 16 19 15 37 36 21 22 27 23 26 18 28 32 31 33 38 6 25 24 35 Figure 1 Assembled Open Q 845 µSOM Development Kit ...

Page 12: ...or Header J802 10 Audio I O Header J2000 11 USB 3 1 Type C connector for ADB J2300 12 USB Serial Debug Console J1600 13 WLAN BT Channel 0 External Antenna Connector J2701 14 WLAN Channel 1 External Antenna Connector J2700 15 Camera 1 Connector J1000 16 Camera 2 Connector J1100 17 Camera 3 Connector J1200 18 Camera 4 Connector J1300 19 Flash 1 Header J1001 20 Flash 2 Header J1201 21 Sensors Expansi...

Page 13: ...enna Connector J2200 on µSOM 32 Open Q 845 µSOM WLAN CH1 Antenna Connector J2201 on µSOM 33 Open Q 845 µSOM 34 On Board Quiet Thermistor RT800 35 SOM Current Sense Probe Header J301 36 LEDs Charge State Power Blue Green Red DS2503 DS2504 DS2500 DS2501 DS2502 37 System Configuration DIP Switch S2600 38 Open Q LCD Panel 3 4 2 Block Diagram The block diagram below shows the connectivity and major com...

Page 14: ...2 CSI 1 CSI 0 DSI 1 I2S Audio Out GPIO Expansion Header BLSP GPIO PCB Trace Antenna PCB Trace Antenna U FL U FL U FL Boot Mode Switches SOM Power Probe Pwr Pwr Coin Cell Boot Mode Audio Outputs U FL Coax Cables USB1 SS Tx USB1 SS RX SS DisplayPort DP video audio USB3 Type A Camera Conn 1 Camera Conn 2 WCD9340 Codec Module Audio Input Header Audio Output Header Audio Inputs Headset I O SLIMBus Audi...

Page 15: ...ber 3 5 2 Configuration Switch Settings The default configuration for the system configuration DIP switch S2600 is for all switches to be open or OFF For details about other configurations see section 3 7 2 3 5 3 Powering Up the Development Kit The development kit can be powered up by either using a DC power supply or by connecting a battery on connector J300 Select the desired power source using ...

Page 16: ...connecting any hardware device to the development kit that it is compatible with the Open Q 845 hardware specifications See Figure 1 for position on carrier board Table 2 Carrier Board Features Item Position Description Specification Usage Form Factor Dimensions 170mm x 170mm Mini ITX Form Factor SOM Interface 33 3 x 100 pin Hirose DF40 connectors SOM power and signal IO connection to carrier boar...

Page 17: ...ication for DPHY v1 2 For connecting display accessory CSI Camera connectors 15 16 17 18 4x camera connectors MIPI Alliance Specification for CSI 2 v1 3 For connecting camera accessories Flash driver 19 20 2 x Flash drivers Low current flash driver control Flash control Current Sense Header 35 3 pin header Sense lines connected across 0 005 Ohm resistor To measure current consumption of SOM Mini P...

Page 18: ...d to CPU GPIO99 For default boot configuration leave open OFF Other boot configurations not supported BOOT_CONFIG 2 S2600 4 CPU boot configuration bit 2 Connected to CPU GPIO100 For default boot configuration leave open OFF Other boot configurations not supported CBL_PWR_N S2600 5 Controls the auto boot of the SOM when power is applied Default configuration is open OFF To enable auto boot of the S...

Page 19: ...DC power supply as the power source slide the switch towards the 12V position To power up the kit using the battery slide the switch towards the BATT position The default position is 12V 3 7 3 2 Battery ID and Thermistor Configuration DIP Switch S301 4 The 2 position DIP switch S301 shown in the figure above configures the battery ID and thermistor settings The table below describes the settings f...

Page 20: ...oard includes circuitry to convert the 12V input into different voltage rails that are needed by 845 µSOM and carrier board peripherals 3 7 3 4 Battery Connector J300 3 For a battery powered Open Q 845 µSOM Development Kit the battery connector J300 see location in figure above is used for connection to the battery The table below describes the pinout of the battery connector For more information ...

Page 21: ...E_N SOM power negative current sense line 3 GND System Ground To obtain power consumption measurements the header is connected to a data acquisition unit Keithley 2701 or similar and the voltages on the SOM_PWR_SENSE_P N pins are captured a few times a second over the test period typically 30 minutes The SOM power consumption is then calculated as where Rsense 5 milliohms 𝑃𝑃𝑃𝑃𝑃𝑃𝑃𝑃 𝑉𝑉𝑉𝑉𝑉𝑉𝑚𝑚𝑝𝑝𝑝𝑝𝑟𝑟𝑠𝑠...

Page 22: ...2P85 2 85V Carrier Board LDO for Camera 1 VCM 3 MB_ELDO_CAM3_DVDD_1P1 1 1V Carrier Board LDO for Camera 4 DVDD Camera core 4 GND System Ground 5 MB_VREG_1P8 1 8V Carrier Board Buck Power Supply for general 1 8V rail 6 MB_ELDO_CAM3_VCM_2P85 2 85V Carrier Board LDO for Camera 4 VCM 7 MB_ELDO_CAM1_DVDD_1P1 1 1V Carrier Board LDO for Camera 2 DVDD Camera core 8 MB_ELDO_CAM1_VCM_2P85 2 8V Carrier Board...

Page 23: ...arrier Board Boost Power Supply for general 5 0V rail 20 DC_IN_12V Main 12 0V Power from DC power jack 3 7 7 User Buttons and LEDs 7 36 There are four user buttons and four LED s on the Open Q 845 µSOM Development Kit as described in the tables below See items 7 and 36 in Figure 1 for the carrier board locations of the user buttons and LEDs respectively ...

Page 24: ... user needs to ensure that the appropriate FTDI drivers are installed Use latest FTDI drivers from https www ftdichip com FTDrivers htm instead of system update See item 12 in Figure 1 for the location of J1600 on the carrier board 3 7 9 USB 3 1 Type C for ADB J2300 11 The Open Q 845 carrier board contains one USB 3 1 Type C connection J2300 This connection is used for Android debug bridge ADB fun...

Page 25: ... below then the Mini PCIe USB enable DIP switch S2401 6 must be switched to closed ON figure below If the DIP switch is closed the USB 3 1 Type A connector is not functional Figure 6 Mini PCIe USB Enable DIP Switch 6 3 7 11 Micro SD Card Socket J1500 22 J1500 Micro SD card connector provides 4 bit secure digital SD interface for external storage It is located on the bottom side of the carrier boar...

Page 26: ...Open Q 845 µSOM Development Kit It can be purchased by contacting Lantronix Sales Exposed on the display connector are the following interfaces Two 4 lane MIPI DSI high speed display interfaces LCD backlight control signals I2C bus for touch panel support Additional GPIOs for general purposes available Various power rails for powering the display adapter For details on the signal list provided on ...

Page 27: ...ffers compatible camera module accessories for the Open Q 845 µSOM Development Kit here https shop intrinsyc com collections accessories Exposed on each camera connector are the following interfaces One 4 lane MIPI CSI high speed camera interface o NOTE The camera 4 connector J1300 includes only a 2 lane MIPI CSI interface Camera Control Interface CCI I2C bus for camera and actuator control Additi...

Page 28: ... the carrier board locations of the camera flash connectors The pinout of the connectors in shown in the table below The typical interfacing to these camera flash channels is shown in the figure below Table 10 Camera Flash Connectors pinout Pin No Signal Name Description 1 SOM_SYS_PWR_PER System power 3 9V Current limited to 0 5A 2 GND System ground 3 GPIO_22_FL_STROBE_TRIG CPU GPIO 22 input from ...

Page 29: ...2800 25 can be used if the user is connecting a mini PCIe card with cellular connection capabilities If the user intends to use a mini PCIe card on the dev kit that requires a USB connection then the Mini PCIe USB enable DIP switch S2401 6 must be switched to closed ON See Figure 6 Mini PCIe USB Enable DIP Switch 6 If the DIP switch is closed the USB 3 1 Type A connector J2400 5 is not functional ...

Page 30: ...6 GPIO7_LCD1_RST_N CPU GPIO7 17 GND Ground 18 GND Ground 19 No Net 20 MB_VREG_5P0 Carrier board switching regulator 5 0V For more details regarding configuring the GPIOs on this header refer to the Open Q 845 Software Release Notes to determine feature support in the latest software release 3 7 17 Sensor IO Expansion Header J2100 21 The Open Q 845 µSOM Development Kit includes a sensor expansion h...

Page 31: ..._IN4_P Codec Input 4 Positive 8 CDC_IN4_N Codec Input 4 Negative 9 CDC_MIC_BIAS4 Microphone Bias 4 10 MB_VREG_3P3 Carrier board switching regulator 3 3V 11 GND System Ground 12 GND System Ground 13 CDC_DMIC_CLK0 Digital Microphone 0 Clock 14 CDC_DMIC_CLK1 Digital Microphone 1 Clock 15 CDC_DMIC_DATA0 Digital Microphone 0 Data 16 CDC_DMIC_DATA1 Digital Microphone 1 Data 17 VREG_S4A_1P8 µSOM LDO Regu...

Page 32: ...ative 11 GND System Ground 12 SOM_SYS_PWR_PER SOM System Power 13 CDC_SWR_CLK Codec PDM Clock 14 CDC_SWR_DATA Codec PDM Data 15 CDC_WSA_EN Codec GPIO can be used as Speaker Amp Enable 1 16 PMI8998_SPKR_AMP_E N2 µSOM PMIC GPIO11 can be used as Speaker Amp Enable 2 17 VREG_S4A_1P8 µSOM LDO Regulator S4A 1 8V 18 DC_IN_12V Voltage from DC Power Input 12 0V 19 MB_VREG_5P0 Carrier board switching regula...

Page 33: ...and clock output see Note 1 below 15 GPIO67_CODEC_S PI_CLK CPU GPIO67 can be configured as PRI_MI2S_DATA0 see Note 1 below 16 No net 17 GPIO68_CODEC_S PI_CS_N CPU GPIO68 can be configured as PRI_MI2S_DATA1 see Note 1 below 18 CDC_IN5_P Codec Input 5 Positive 19 GND Ground 20 CDC_IN5_N Codec Input 5 Negative 21 GPIO69_SPKR_I2S _SCK CPU GPIO69 can be configured as SPKR_I2S_SCK 22 GND Ground 23 GPIO7...

Page 34: ... two spatial streams IEEE802 11 a b g n ac WLAN standards and Bluetooth LE 5 x HS enabling seamless integration of WLAN Bluetooth and low energy technology The WCN3990 chipset is located on the µSOM which has U FL coax connectors for channel 0 WLAN BT and channel 1 WLAN only These connectors are mated to the Carrier board WLAN BT PCB antennas via coax cables Figure 1 in 3 4 1 above shows how the t...

Page 35: ...45 µSOM Development Kit Open Q 845 µSOM Development Kit User Guide 35 Table 16 Haptic Output Header Pinout J802 Pin No Signal Description 1 HAP_OUT_R_P Haptic output positive 2 HAP_OUT_R_N Haptic output negative ...

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