GPS/GLONASS Receiver Module A5100-A User Guide
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7
Mounting
This chapter describes the suggested mounting process for the
A5100-A
receiver
modules. In a RoHS compliant product with a RoHS compliant process it is recom-
mended to use chemical tin as the counter-pa
rt to the module’s pins. This will guar-
antee highest resistance against shocks.
7.1 Proposed Footprint for Soldering
Following soldering footprint parameters are recommended:
•
Copper and solder paste footprint are identical
•
Pad-shape / -size, inner pads: 1.2 mm x 1.2 mm
•
Pad-shape / -size, outer pads: 1.5 mm x 0.8 mm
•
Stencil thickness of 120
– 150 µm
Figure 13: Recommended Solder PAD Layout