BT830 Hardware Integration Guide
Version 1.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
32
Laird Technologies
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
There are 2500 BT830 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (12,500
modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See following images (Figures
24-32).
Packaging Process
Figure 22: BT800 packaging process
Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New
packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during
storage and shipment. If directed to
bake units on the card, see
and follow instructions specified by
IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in
, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a
new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient
environment
30°C/60%RH.
Table 17: Recommended baking times and temperatures
MSL
125
°
C
Baking Temp.
90
°
C/
≤
5%RH
Baking Temp.
40
°
C/
≤
5%RH
Baking Temp.
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
3
9 hours
7 hours
33 hours
23 hours
13 days
9 days