RAK-100S-DNV - User Guide, Rev. 1.0
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Thermal Considerations
6.1.
Available Processors
Please refer to the chapter 10/ "Technical Specifications".
The list of processors may be extended over the product lifetime.
6.2.
Convection Cooling
The applied cooling method provides adequate cooling of the device during operation and performs a one-way
thermal transfer to the airflow. There are ventilation holes located on the front and rear sides of the RAK-100S-DNV.
They provides heat dissipation during operation.
To provide sufficient heat dissipation for the cooling of the RAK-100S-DNV, never cover
the ventilation holes of the chassis. Do not place any objects on the device.
6.3.
System Clearance
To provide a maximum of airflow through and around the box, proper distances to surrounding parts must be
observed.
6.4.
Maximum Temperatures
The maximum system ambient temperature depends mostly on the power consumption
of the processor and the chipset.
For the temperature evaluation a specialised tool from Intel® was used to set the processor to a defined workload.
Depending on the power consumption one or more cores were set to 75% workload. This includes the graphics core.
The tool also handles the usage of the "Turbo Mode" of certain processor types.
The processor utilization depends highly on the software used. Software using
multicore feature will run on several cores whereas standard software will only utilize
one core. In this case the processor will use the "Turbo Mode" to increase the clock for
the core with the highest workload, as long as the temperature is within limits.
6.5.
Third Party Components
