<Sub board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
S1D
LVA10923-A2
PbF
MARK
UL
CN351
R3501
R3502
R351
0
CN35
2
S3502
R3504
S3501
R3507
R3505
Q3501
IC35
1
R3509
R3508
R350
3
R3506
created date:2010-06-18
No.MA473
(No.MA473<Rev.002>)24/31
Summary of Contents for KW-ADV793J
Page 33: ... No MA473 Rev 002 1 33 MEMO ...
Page 37: ... MA473 R002 3 ...